Design and Fabrication of SOI-based photonic crystal components

Peter Ingo Borel (Invited author), Lars Hagedorn Frandsen (Invited author), Anders Harpøth (Invited author), M. Kristensen (Invited author), Tapio Niemi (Invited author), P. Xing (Invited author), Jakob Søndergaard Jensen (Invited author), Ole Sigmund (Invited author)

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

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    Abstract

    We present examples of ultra-compact photonic crystal components realized in silicon-on-insulator material. We have fabricated several different types of photonic crystal waveguide components displaying high transmission features. This includes 60° and 120° bends, different types of couplers, and splitters. Recently, we have designed and fabricated components with more than 200 nm bandwidths. Design strategies to enhance the performance include systematic variation of design parameters using finite-difference time-domain simulations and inverse design methods such as topology optimization.
    Original languageEnglish
    Title of host publicationProcedings of 6th IEEE International Conference on Transparent Optical Networks ICTON 2004
    Volume1
    Place of PublicationWarsaw, Poland
    PublisherNational Institute of Telecommunications
    Publication date2004
    Pages271-275
    ISBN (Print)0-7803-8343-5
    Publication statusPublished - 2004
    Event6th IEEE International Conference on Transparent Optical Networks - Wroclaw, Poland
    Duration: 4 Jul 20048 Jul 2004
    Conference number: 6

    Conference

    Conference6th IEEE International Conference on Transparent Optical Networks
    Number6
    Country/TerritoryPoland
    CityWroclaw
    Period04/07/200408/07/2004

    Bibliographical note

    Marian Marciniak (ed)
    Copyright: 2004 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE

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