Deep reactive ion etching of ‘grass-free’ widely-spaced periodic 2D arrays, using sacrificial structures

Chantal M. Silvestre*, Vy Thi Hoang Nguyen, Henri Jansen, Ole Hansen

*Corresponding author for this work

Research output: Contribution to journalJournal articleResearchpeer-review

Abstract

We fabricated two-dimensional arrays of periodic, widely-spaced pillars using deep reactive ion etching of silicon. To avoid the formation of micro-grass in the large open areas we used sacrificial structures surrounding the widely-spaced pillars. The use of sacrificial structures results in a denser pattern where the formation of grass is less likely to happen. We were able to remove the sacrificial structures without damaging the main array of pillars by using a modified Bosch process. The roughness remaining after removal of the sacrificial structures was evaluated using optical profilometry. Using this method, we were able to pattern grass-free arrays of widely-spaced 12 μm diameter pillars of 9:1 aspect ratio, with hexagonal and square distributions.
Original languageEnglish
Article number111228
JournalMicroelectronic Engineering
Volume223
Number of pages11
ISSN0167-9317
DOIs
Publication statusPublished - 2020

Keywords

  • ARDE
  • Plasma etching
  • Periodic structures
  • High aspect ratio
  • Sacrificial structures
  • Silicon patterning

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