Corrosion reliability of lead-free solder systems used in electronics

Feng Li; Vadimas Verdingovas; Balint Medgyes; Rajan Ambat

doi:10.1109/ISSE.2017.8000929

Corrosion reliability of lead-free solder systems used in electronics

Feng Li, Vadimas Verdingovas, Balint Medgyes, Rajan Ambat

Budapest University of Technology and Economics

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

Abstract

Corrosion reliability of five Sn-Ag-Cu (SAC) based lead-free solder alloys under humid and corrosive conditions has been investigated to understand the microstructure effects on corrosion performance. Electrochemical experiments such as potentiodynamic and potentiostatic tests were conducted in 3.5 wt% sodium chloride electrolyte at room temperature. Microstructure of the solder alloys and corrosion surface morphology was evaluated using light optical microscope (LOM) scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD). During the potentiostatic tests, the cathodically active Bi phase in No. 5 alloy introduced pitting in the Sn phase nearby, whereas AgsSn phase prompted pitting on the adjacent to ß-Sn phase in No. 1–4 solder alloys (Table 1.).

Original language	English
Title of host publication	Proceedings of the 40th International Spring Seminar on Electronics Technology (ISSE), 2017
Number of pages	6
Publisher	IEEE
Publication date	2017
ISBN (Electronic)	978-1-5386-0582-0
DOIs	https://doi.org/10.1109/ISSE.2017.8000929
Publication status	Published - 2017
Event	40th International Spring Seminar on Electronics Technology - Sofia, Bulgaria Duration: 10 May 2017 → 14 May 2017

Conference

Conference	40th International Spring Seminar on Electronics Technology
Country/Territory	Bulgaria
City	Sofia
Period	10/05/2017 → 14/05/2017

Keywords

Corrosion
Surface morphology
Microstructure
Reliability
Lead
X-ray scattering

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title = "Corrosion reliability of lead-free solder systems used in electronics",

abstract = "Corrosion reliability of five Sn-Ag-Cu (SAC) based lead-free solder alloys under humid and corrosive conditions has been investigated to understand the microstructure effects on corrosion performance. Electrochemical experiments such as potentiodynamic and potentiostatic tests were conducted in 3.5 wt% sodium chloride electrolyte at room temperature. Microstructure of the solder alloys and corrosion surface morphology was evaluated using light optical microscope (LOM) scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD). During the potentiostatic tests, the cathodically active Bi phase in No. 5 alloy introduced pitting in the Sn phase nearby, whereas AgsSn phase prompted pitting on the adjacent to {\ss}-Sn phase in No. 1–4 solder alloys (Table 1.).",

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AU - Li, Feng

AU - Verdingovas, Vadimas

AU - Medgyes, Balint

AU - Ambat, Rajan

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N2 - Corrosion reliability of five Sn-Ag-Cu (SAC) based lead-free solder alloys under humid and corrosive conditions has been investigated to understand the microstructure effects on corrosion performance. Electrochemical experiments such as potentiodynamic and potentiostatic tests were conducted in 3.5 wt% sodium chloride electrolyte at room temperature. Microstructure of the solder alloys and corrosion surface morphology was evaluated using light optical microscope (LOM) scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD). During the potentiostatic tests, the cathodically active Bi phase in No. 5 alloy introduced pitting in the Sn phase nearby, whereas AgsSn phase prompted pitting on the adjacent to ß-Sn phase in No. 1–4 solder alloys (Table 1.).

AB - Corrosion reliability of five Sn-Ag-Cu (SAC) based lead-free solder alloys under humid and corrosive conditions has been investigated to understand the microstructure effects on corrosion performance. Electrochemical experiments such as potentiodynamic and potentiostatic tests were conducted in 3.5 wt% sodium chloride electrolyte at room temperature. Microstructure of the solder alloys and corrosion surface morphology was evaluated using light optical microscope (LOM) scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction (XRD). During the potentiostatic tests, the cathodically active Bi phase in No. 5 alloy introduced pitting in the Sn phase nearby, whereas AgsSn phase prompted pitting on the adjacent to ß-Sn phase in No. 1–4 solder alloys (Table 1.).

KW - Corrosion

KW - Surface morphology

KW - Microstructure

KW - Reliability

KW - Lead

KW - X-ray scattering

U2 - 10.1109/ISSE.2017.8000929

DO - 10.1109/ISSE.2017.8000929

M3 - Article in proceedings

BT - Proceedings of the 40th International Spring Seminar on Electronics Technology (ISSE), 2017

PB - IEEE

T2 - 40th International Spring Seminar on Electronics Technology

Y2 - 10 May 2017 through 14 May 2017

ER -

Corrosion reliability of lead-free solder systems used in electronics

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Keywords

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