Corrosion Reliability of Lead-free Solder Systems Used in Electronics

Feng Li, Vadimas Verdingovas, Balint Medgyes, Rajan Ambat

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Abstract

The present work investigated the corrosion reliability of Sn-Ag-Cu based five lead-free solder alloys. The corrosion and electrochemical migration (ECM) susceptibility study of the solder alloys has been carried out by water droplet (WD) tests on pure alloy ingot samples, and by accelerated humidity/temperature cycling tests on soldered surface insulation resistance (SIR) comb pattern. Complimentary microstructural and phase analysis of solder alloys has been carried out using the scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD) methods. The galvanic corrosion was found between cathodically active Bi phase and anodic (Sn, Sb) solid solution in InnoLot alloy, while the Ag3Sn phase was cathodically active in the other four alloys. The paper theoretically illustrated the reason for the differences in corrosion reliability in the five alloys based on the composition and distribution of intermetallic compounds (IMCs).
Original languageEnglish
Title of host publicationProceedings of the European Corrosion Congress (EUROCORR 2017)
Number of pages10
Publication date2017
Article number98245
Publication statusPublished - 2017
EventEuropean Corrosion Congress (EUROCORR 2017) - Prague, Czech Republic
Duration: 3 Sep 20177 Sep 2017

Conference

ConferenceEuropean Corrosion Congress (EUROCORR 2017)
CountryCzech Republic
CityPrague
Period03/09/201707/09/2017

Keywords

  • Lead-free
  • Solder alloy
  • Electrochemical migration
  • Microstructure
  • Intermetallic

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