Abstract
The present work investigated the corrosion reliability of Sn-Ag-Cu based five lead-free solder alloys. The corrosion and electrochemical migration (ECM) susceptibility study of the solder alloys has been carried out by water droplet (WD) tests on pure alloy ingot samples, and by accelerated humidity/temperature cycling tests on soldered surface insulation resistance (SIR) comb pattern. Complimentary microstructural and phase analysis of solder alloys has been carried out using the scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and X-ray diffraction (XRD) methods. The galvanic corrosion was found between cathodically active Bi phase and anodic (Sn, Sb) solid solution in InnoLot alloy, while the Ag3Sn phase was cathodically active in the other four alloys. The paper theoretically illustrated the reason for the differences in corrosion reliability in the five alloys based on the composition and distribution of intermetallic compounds (IMCs).
| Original language | English |
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| Title of host publication | Proceedings of the European Corrosion Congress (EUROCORR 2017) |
| Number of pages | 10 |
| Publication date | 2017 |
| Article number | 98245 |
| Publication status | Published - 2017 |
| Event | European Corrosion Congress (EUROCORR 2017) - Prague, Czech Republic Duration: 3 Sept 2017 → 7 Sept 2017 |
Conference
| Conference | European Corrosion Congress (EUROCORR 2017) |
|---|---|
| Country/Territory | Czech Republic |
| City | Prague |
| Period | 03/09/2017 → 07/09/2017 |
Keywords
- Lead-free
- Solder alloy
- Electrochemical migration
- Microstructure
- Intermetallic