Abstract
This manuscript gives a brief overview on the studies of thermal decomposition of solder flux systems commonly used in the electronic industry. Changes in chemical composition and structural changes of the flux components have been investigated as a function of temperature. Six weak organic acids, serving as flux activators, have been studied. Additionally, eleven industrially used solder flux systems have been investigated towards their thermal decomposition pattern. The results show the formation of additional species at high soldering temperatures, some having more aggressive nature than the initial flux components.
| Original language | English |
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| Title of host publication | Proceedings of EuroCorr 2014 |
| Number of pages | 11 |
| Publication date | 2014 |
| Publication status | Published - 2014 |
| Event | European Corrosion Congress - Palazzo dei Congressi of Pisa, Pisa, Italy Duration: 8 Sept 2014 → 12 Sept 2014 http://www.eurocorr2014.org/scope.htm |
Conference
| Conference | European Corrosion Congress |
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| Location | Palazzo dei Congressi of Pisa |
| Country/Territory | Italy |
| City | Pisa |
| Period | 08/09/2014 → 12/09/2014 |
| Internet address |