Correlation between MEMS Adhesive cure Degree and acoustic Impedance determined with Differential Scanning Calorimetry and Scanning Acoustic Microscopy

Jakob Janting; Uffe Bennov; Anders Black

Correlation between MEMS Adhesive cure Degree and acoustic Impedance determined with Differential Scanning Calorimetry and Scanning Acoustic Microscopy

Jakob Janting, Uffe Bennov, Anders Black

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

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Original language	English
Title of host publication	Proceedings of Workshop on MEMS Sensor Packaging
Number of pages	2
Publication date	2003
ISBN (Print)	87-89935-46-2
Publication status	Published - 2003
Externally published	Yes
Event	Workshop on MEMS Sensor Packaging - Technical University of Denmark, Lyngby, Denmark Duration: 20 Mar 2003 → 21 Mar 2003

Conference

Conference	Workshop on MEMS Sensor Packaging
Location	Technical University of Denmark
Country/Territory	Denmark
City	Lyngby
Period	20/03/2003 → 21/03/2003

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@inproceedings{f1415b1b03dd447aa18c4d5925687383,

title = "Correlation between MEMS Adhesive cure Degree and acoustic Impedance determined with Differential Scanning Calorimetry and Scanning Acoustic Microscopy",

author = "Jakob Janting and Uffe Bennov and Anders Black",

year = "2003",

language = "English",

isbn = "87-89935-46-2",

booktitle = "Proceedings of Workshop on MEMS Sensor Packaging",

note = "Workshop on MEMS Sensor Packaging ; Conference date: 20-03-2003 Through 21-03-2003",

}

Correlation between MEMS Adhesive cure Degree and acoustic Impedance determined with Differential Scanning Calorimetry and Scanning Acoustic Microscopy. / Janting, Jakob; Bennov, Uffe; Black, Anders.
Proceedings of Workshop on MEMS Sensor Packaging. 2003.

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

TY - GEN

T1 - Correlation between MEMS Adhesive cure Degree and acoustic Impedance determined with Differential Scanning Calorimetry and Scanning Acoustic Microscopy

AU - Janting, Jakob

AU - Bennov, Uffe

AU - Black, Anders

PY - 2003

Y1 - 2003

M3 - Article in proceedings

SN - 87-89935-46-2

BT - Proceedings of Workshop on MEMS Sensor Packaging

T2 - Workshop on MEMS Sensor Packaging

Y2 - 20 March 2003 through 21 March 2003

ER -