Correlation between MEMS Adhesive cure Degree and acoustic Impedance determined with Differential Scanning Calorimetry and Scanning Acoustic Microscopy

Jakob Janting, Uffe Bennov, Anders Black

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

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Original languageEnglish
Title of host publicationProceedings of Workshop on MEMS Sensor Packaging
Number of pages2
Publication date2003
ISBN (Print)87-89935-46-2
Publication statusPublished - 2003
Externally publishedYes
EventWorkshop on MEMS Sensor Packaging - Technical University of Denmark, Lyngby, Denmark
Duration: 20 Mar 200321 Mar 2003


ConferenceWorkshop on MEMS Sensor Packaging
LocationTechnical University of Denmark

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