Continuous dynamic recrystallization in a Zn–Cu–Ti sheet subjected to bilinear tensile strain

Research on zinc sheet formability, relevant for its technological applications, requires deeper understanding of the microstructural features that govern the plastic response of the material. In this work, a microstructural analysis by means of electron back-scattered diffraction (EBSD) technique was conducted on a commercial Zn–Cu–Ti sheet subjected to a bilinear tensile test at room temperature and low strain rate (5 × 10⁻⁴ s⁻¹). The refinement of the granular structure is analyzed in terms of the development of subgrains within initially large grains, which eventually evolve into high angle boundary grains. This continuous dynamic recrystallization (CDRX) mechanism appears as a key factor in order to explain the grain fragmentation process and the weakening of the texture observed during straining of this alloy.