Continuous dynamic recrystallization in a Zn–Cu–Ti sheet subjected to bilinear tensile strain

M. Leonard*, C. Moussa, A. Roatta, A. Seret, J. W. Signorelli

*Corresponding author for this work

    Research output: Contribution to journalJournal articleResearchpeer-review

    61 Downloads (Orbit)

    Abstract

    Research on zinc sheet formability, relevant for its technological applications, requires deeper understanding of the microstructural features that govern the plastic response of the material. In this work, a microstructural analysis by means of electron back-scattered diffraction (EBSD) technique was conducted on a commercial Zn–Cu–Ti sheet subjected to a bilinear tensile test at room temperature and low strain rate (5 × 10−4 s−1). The refinement of the granular structure is analyzed in terms of the development of subgrains within initially large grains, which eventually evolve into high angle boundary grains. This continuous dynamic recrystallization (CDRX) mechanism appears as a key factor in order to explain the grain fragmentation process and the weakening of the texture observed during straining of this alloy.
    Original languageEnglish
    Article number139689
    JournalMaterials Science and Engineering A
    Volume789
    Number of pages11
    ISSN0921-5093
    DOIs
    Publication statusPublished - 2020

    Keywords

    • Zinc sheet
    • Continuous dynamic recrystallization
    • Formability
    • Texture

    Fingerprint

    Dive into the research topics of 'Continuous dynamic recrystallization in a Zn–Cu–Ti sheet subjected to bilinear tensile strain'. Together they form a unique fingerprint.

    Cite this