Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating

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    Abstract

    Typical printed circuit board assemblies (PCBAs) processed by reflow, wave, or selective wave soldering were analysed for typical levels of process related residues, resulting from a specific or combination of soldering process. Typical solder flux residue distribution pattern, composition, and concentration are profiled and reported. Presence of localized flux residues were visualized using a commercial Residue RAT gel test and chemical structure was identified by FT-IR, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode setup. Localized extraction of residue was carried out using a commercial C3 extraction system. Results clearly show that the amount and distribution of flux residues are a function of the soldering process, and the level can be reduced by an appropriate cleaning. Selective soldering process generates significantly higher levels of residues compared to the wave and reflow process. For conformal coated PCBAs, the contamination levels generated from the tested wave and selective soldering process are found to be enough to generate blisters under exposure to high humidity levels.
    Original languageEnglish
    Title of host publicationProceedings of EuroCorr 2014
    Number of pages9
    Publication date2014
    Publication statusPublished - 2014
    EventEuropean Corrosion Congress - Palazzo dei Congressi of Pisa, Pisa, Italy
    Duration: 8 Sept 201412 Sept 2014
    http://www.eurocorr2014.org/scope.htm

    Conference

    ConferenceEuropean Corrosion Congress
    LocationPalazzo dei Congressi of Pisa
    Country/TerritoryItaly
    CityPisa
    Period08/09/201412/09/2014
    Internet address

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