Contact of ZnSb thermoelectric material to metallic electrodes using S-Bond 400 solder alloy

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ZnSb is one of the promising low-cost p-type thermoelectric materials for constructing waste heat recovery devices operating in the medium temperature region (250 – 400 ᵒC). To obtain high performance, these devices require stable and low resistance contacts between thermoelectric materials and metallic electrodes. In this paper, we investigate the joining of ZnSb to Ni and Ag electrodes using a commercial solder alloy S-Bond 400 and hot-pressing technique. Ti and Cr layers are also introduced as a diffusion barrier and microstructure at the interfaces is observed by scanning electron microscopy. We found that S-bond 400 solder reacts with Ag and Ni electrodes to form different alloys at the interfaces. Cr layer was found to be broken after joining, resulting in a thicker reaction/diffusion layer at the interface, while Ti layer was preserved.
Original languageEnglish
JournalMaterials Today: Proceedings
Volume8
Issue number2
Pages (from-to)625-631
ISSN2214-7853
DOIs
Publication statusPublished - 2019
Event15th European Conference on Thermoelectrics (ECT2017) - Padua, Italy
Duration: 25 Sep 201727 Sep 2017
Conference number: 15
http://ect2017padova.it/

Conference

Conference15th European Conference on Thermoelectrics (ECT2017)
Number15
CountryItaly
CityPadua
Period25/09/201727/09/2017
Internet address
CitationsWeb of Science® Times Cited: No match on DOI

    Research areas

  • Thermoelectric modules, Interface kinetics, Zinc antimonide, S-bond 400
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