Contact of ZnSb thermoelectric material to metallic electrodes using S-Bond 400 solder alloy

Safdar Abbas Malik, Thanh Hung Le, Ngo Van Nong*

*Corresponding author for this work

Research output: Contribution to journalConference articleResearchpeer-review

Abstract

ZnSb is one of the promising low-cost p-type thermoelectric materials for constructing waste heat recovery devices operating in the medium temperature region (250 – 400 ᵒC). To obtain high performance, these devices require stable and low resistance contacts between thermoelectric materials and metallic electrodes. In this paper, we investigate the joining of ZnSb to Ni and Ag electrodes using a commercial solder alloy S-Bond 400 and hot-pressing technique. Ti and Cr layers are also introduced as a diffusion barrier and microstructure at the interfaces is observed by scanning electron microscopy. We found that S-bond 400 solder reacts with Ag and Ni electrodes to form different alloys at the interfaces. Cr layer was found to be broken after joining, resulting in a thicker reaction/diffusion layer at the interface, while Ti layer was preserved.
Original languageEnglish
JournalMaterials Today: Proceedings
Volume8
Issue number2
Pages (from-to)625-631
ISSN2214-7853
DOIs
Publication statusPublished - 2019
Event15th European Conference on Thermoelectrics (ECT2017) - Padua, Italy
Duration: 25 Sep 201727 Sep 2017
Conference number: 15
http://ect2017padova.it/

Conference

Conference15th European Conference on Thermoelectrics (ECT2017)
Number15
CountryItaly
CityPadua
Period25/09/201727/09/2017
Internet address

Keywords

  • Thermoelectric modules
  • Interface kinetics
  • Zinc antimonide
  • S-bond 400

Cite this

Malik, Safdar Abbas ; Le, Thanh Hung ; Van Nong, Ngo. / Contact of ZnSb thermoelectric material to metallic electrodes using S-Bond 400 solder alloy. In: Materials Today: Proceedings. 2019 ; Vol. 8, No. 2. pp. 625-631.
@inproceedings{f6f1d5f5b639495f8df2713e4ca894a4,
title = "Contact of ZnSb thermoelectric material to metallic electrodes using S-Bond 400 solder alloy",
abstract = "ZnSb is one of the promising low-cost p-type thermoelectric materials for constructing waste heat recovery devices operating in the medium temperature region (250 – 400 ᵒC). To obtain high performance, these devices require stable and low resistance contacts between thermoelectric materials and metallic electrodes. In this paper, we investigate the joining of ZnSb to Ni and Ag electrodes using a commercial solder alloy S-Bond 400 and hot-pressing technique. Ti and Cr layers are also introduced as a diffusion barrier and microstructure at the interfaces is observed by scanning electron microscopy. We found that S-bond 400 solder reacts with Ag and Ni electrodes to form different alloys at the interfaces. Cr layer was found to be broken after joining, resulting in a thicker reaction/diffusion layer at the interface, while Ti layer was preserved.",
keywords = "Thermoelectric modules, Interface kinetics, Zinc antimonide, S-bond 400",
author = "Malik, {Safdar Abbas} and Le, {Thanh Hung} and {Van Nong}, Ngo",
year = "2019",
doi = "10.1016/j.matpr.2019.02.062",
language = "English",
volume = "8",
pages = "625--631",
journal = "Materials Today: Proceedings",
issn = "2214-7853",
publisher = "Elsevier",
number = "2",

}

Contact of ZnSb thermoelectric material to metallic electrodes using S-Bond 400 solder alloy. / Malik, Safdar Abbas; Le, Thanh Hung; Van Nong, Ngo.

In: Materials Today: Proceedings, Vol. 8, No. 2, 2019, p. 625-631.

Research output: Contribution to journalConference articleResearchpeer-review

TY - GEN

T1 - Contact of ZnSb thermoelectric material to metallic electrodes using S-Bond 400 solder alloy

AU - Malik, Safdar Abbas

AU - Le, Thanh Hung

AU - Van Nong, Ngo

PY - 2019

Y1 - 2019

N2 - ZnSb is one of the promising low-cost p-type thermoelectric materials for constructing waste heat recovery devices operating in the medium temperature region (250 – 400 ᵒC). To obtain high performance, these devices require stable and low resistance contacts between thermoelectric materials and metallic electrodes. In this paper, we investigate the joining of ZnSb to Ni and Ag electrodes using a commercial solder alloy S-Bond 400 and hot-pressing technique. Ti and Cr layers are also introduced as a diffusion barrier and microstructure at the interfaces is observed by scanning electron microscopy. We found that S-bond 400 solder reacts with Ag and Ni electrodes to form different alloys at the interfaces. Cr layer was found to be broken after joining, resulting in a thicker reaction/diffusion layer at the interface, while Ti layer was preserved.

AB - ZnSb is one of the promising low-cost p-type thermoelectric materials for constructing waste heat recovery devices operating in the medium temperature region (250 – 400 ᵒC). To obtain high performance, these devices require stable and low resistance contacts between thermoelectric materials and metallic electrodes. In this paper, we investigate the joining of ZnSb to Ni and Ag electrodes using a commercial solder alloy S-Bond 400 and hot-pressing technique. Ti and Cr layers are also introduced as a diffusion barrier and microstructure at the interfaces is observed by scanning electron microscopy. We found that S-bond 400 solder reacts with Ag and Ni electrodes to form different alloys at the interfaces. Cr layer was found to be broken after joining, resulting in a thicker reaction/diffusion layer at the interface, while Ti layer was preserved.

KW - Thermoelectric modules

KW - Interface kinetics

KW - Zinc antimonide

KW - S-bond 400

U2 - 10.1016/j.matpr.2019.02.062

DO - 10.1016/j.matpr.2019.02.062

M3 - Conference article

VL - 8

SP - 625

EP - 631

JO - Materials Today: Proceedings

JF - Materials Today: Proceedings

SN - 2214-7853

IS - 2

ER -