Abstract
Materials and methods for low cost minimum volume protective encapsulation of microsystems have been investigated. The focus has been on a 3D conformal multilayer coating of silicon microphones. Materials with different properties, e.g. insulating and conductive, can be applied and combined as multilayers around the sharp edges of single crystalline silicon giving a protection which can not be matched by a single material. A 50 mum thick insulating layer with volume resistivity above 10(16) Ohm cm with a 150 mum thick conductive layer on top is reported to have an EMI E-field damping higher than 55 dB in the 50 MHz-1 GHz frequency range.
| Original language | English |
|---|---|
| Journal | Sensors and Actuators A: Physical |
| Volume | 92 |
| Issue number | 1-3 |
| Pages (from-to) | 229-234 |
| ISSN | 0924-4247 |
| DOIs | |
| Publication status | Published - 2001 |
| Externally published | Yes |
Keywords
- Electrical and Electronic Engineering
- Mechanical Engineering
- Instrumentation
- Coating
- Conformal
- Electromagnetic interference (EMI)
- Encapsulation
- Protection
- Coatings
- Electric conductivity of solids
- Electromagnetic field effects
- Microelectronic processing
- Microphones
- Multichip modules
- Semiconducting silicon
- Electromagnetic interference
- Multichip microsystem
- X
Cite this
Janting, J., Branebjerg, J., & Rombach, P. (2001). Conformal coatings for 3D multichip microsystem encapsulation. Sensors and Actuators A: Physical, 92(1-3), 229-234. https://doi.org/10.1016/s0924-4247(01)00567-2