Conformal coatings for 3D multichip microsystem encapsulation

Jakob Janting, Jens Branebjerg, Pirmin Rombach

Research output: Contribution to journalJournal articleResearchpeer-review


Materials and methods for low cost minimum volume protective encapsulation of microsystems have been investigated. The focus has been on a 3D conformal multilayer coating of silicon microphones. Materials with different properties, e.g. insulating and conductive, can be applied and combined as multilayers around the sharp edges of single crystalline silicon giving a protection which can not be matched by a single material. A 50 mum thick insulating layer with volume resistivity above 10(16) Ohm cm with a 150 mum thick conductive layer on top is reported to have an EMI E-field damping higher than 55 dB in the 50 MHz-1 GHz frequency range.
Original languageEnglish
JournalSensors and Actuators A: Physical
Issue number1-3
Pages (from-to)229-234
Publication statusPublished - 2001
Externally publishedYes


  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Instrumentation
  • Coating
  • Conformal
  • Electromagnetic interference (EMI)
  • Encapsulation
  • Protection
  • Coatings
  • Electric conductivity of solids
  • Electromagnetic field effects
  • Microelectronic processing
  • Microphones
  • Multichip modules
  • Semiconducting silicon
  • Electromagnetic interference
  • Multichip microsystem
  • X

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