Abstract
Materials and methods for low cost minimum volume protective encapsulation of microsystems have been investigated. The focus has been on a 3D conformal multilayer coating of silicon microphones. Materials with different properties, e.g. insulating and conductive, can be applied and combined as multilayers around the sharp edges of single crystalline silicon giving a protection which can not be matched by a single material. A 50 mum thick insulating layer with volume resistivity above 10(16) Ohm cm with a 150 mum thick conductive layer on top is reported to have an EMI E-field damping higher than 55 dB in the 50 MHz-1 GHz frequency range.
Original language | English |
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Journal | Sensors and Actuators A: Physical |
Volume | 92 |
Issue number | 1-3 |
Pages (from-to) | 229-234 |
ISSN | 0924-4247 |
DOIs | |
Publication status | Published - 2001 |
Externally published | Yes |
Keywords
- Electrical and Electronic Engineering
- Mechanical Engineering
- Instrumentation
- Coating
- Conformal
- Electromagnetic interference (EMI)
- Encapsulation
- Protection
- Coatings
- Electric conductivity of solids
- Electromagnetic field effects
- Microelectronic processing
- Microphones
- Multichip modules
- Semiconducting silicon
- Electromagnetic interference
- Multichip microsystem
- X