Conformal Coatings for 3D Multichip Microsystem Encapsulation

Jakob Janting, Jens Branebjerg, Pirmin Rombach

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review


Materials and methods for low cost minimum volume protective encapsulation of microsystems have been investigated. Focus has been on a 3D conformal multilayer coating of silicon microphones. Materials with different properties, e.g. insulating and conductive, can be applied and combined as multilayers around the sharp edges of single crystalline silicon giving a protection which can not be matched by a single material. A 50 μm thick insulating layer with volume resistivity above 1016 Wcm with a 150 μm thick conductive layer on top is reported to have an EMI damping higher than 55 dB in the 50 MHz to 1 GHz frequency range.
Original languageEnglish
Title of host publicationEUROSENSORS XIV. Proceedings of the 14. European Conference on Solid-State Transducers
Publication date2000
ISBN (Print)87-89935-50-0
Publication statusPublished - 2000
Externally publishedYes
Event14. European Conference on Solid-State Transducers - Copenhagen, Denmark
Duration: 27 Aug 200030 Aug 2000
Conference number: 14


Conference14. European Conference on Solid-State Transducers


  • Protection
  • Encapsulation
  • Coating
  • Conformal
  • Electromagnetic interference (EMI)


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