Conformal coating by photoresist of sharp corners of anisotropically etched through-holes in silicon

Matthias Heschel; Siebe Bouwstra

Conformal coating by photoresist of sharp corners of anisotropically etched through-holes in silicon

Matthias Heschel, Siebe Bouwstra

Research output: Chapter in Book/Report/Conference proceeding › Book chapter › Research › peer-review

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Abstract

The authors describe a photoresist treatment yielding conformal coating of three-dimensional silicon structures. This even includes the sharp corners of through-holes obtained by anisotropic etching in (100)-silicon. Resist reflow from these corners is avoided by replacing the common baking procedure with a proper vacuum treatment. The investigated photoresist is Shipley's Eagle 2100 ED, a negative-working electrodeposited photoresist. Electrical frontside to backside interconnections have been made using this photoresist as an etch mask

Original language	English
Title of host publication	Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
Publisher	IEEE
Publication date	1997
Pages	209-212
ISBN (Print)	0-7803-3829-4
Publication status	Published - 1997
Event	International Conference on Solid-state Sensors and Actuators (Transducers 1997) - Chicago,IL, United States Duration: 16 Jun 1997 → 19 Jun 1997

Conference

Conference	International Conference on Solid-state Sensors and Actuators (Transducers 1997)
Country/Territory	United States
City	Chicago,IL
Period	16/06/1997 → 19/06/1997

Bibliographical note

Copyright: 1997 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE

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title = "Conformal coating by photoresist of sharp corners of anisotropically etched through-holes in silicon",

abstract = "The authors describe a photoresist treatment yielding conformal coating of three-dimensional silicon structures. This even includes the sharp corners of through-holes obtained by anisotropic etching in (100)-silicon. Resist reflow from these corners is avoided by replacing the common baking procedure with a proper vacuum treatment. The investigated photoresist is Shipley's Eagle 2100 ED, a negative-working electrodeposited photoresist. Electrical frontside to backside interconnections have been made using this photoresist as an etch mask",

author = "Matthias Heschel and Siebe Bouwstra",

note = "Copyright: 1997 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE; International Conference on Solid-state Sensors and Actuators (Transducers 1997), Transducers '97 ; Conference date: 16-06-1997 Through 19-06-1997",

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Heschel, M & Bouwstra, S 1997, Conformal coating by photoresist of sharp corners of anisotropically etched through-holes in silicon. in Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on. IEEE, pp. 209-212, International Conference on Solid-state Sensors and Actuators (Transducers 1997), Chicago,IL, United States, 16/06/1997.

Conformal coating by photoresist of sharp corners of anisotropically etched through-holes in silicon. / Heschel, Matthias; Bouwstra, Siebe.
Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on. IEEE, 1997. p. 209-212.

Research output: Chapter in Book/Report/Conference proceeding › Book chapter › Research › peer-review

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AU - Bouwstra, Siebe

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N2 - The authors describe a photoresist treatment yielding conformal coating of three-dimensional silicon structures. This even includes the sharp corners of through-holes obtained by anisotropic etching in (100)-silicon. Resist reflow from these corners is avoided by replacing the common baking procedure with a proper vacuum treatment. The investigated photoresist is Shipley's Eagle 2100 ED, a negative-working electrodeposited photoresist. Electrical frontside to backside interconnections have been made using this photoresist as an etch mask

AB - The authors describe a photoresist treatment yielding conformal coating of three-dimensional silicon structures. This even includes the sharp corners of through-holes obtained by anisotropic etching in (100)-silicon. Resist reflow from these corners is avoided by replacing the common baking procedure with a proper vacuum treatment. The investigated photoresist is Shipley's Eagle 2100 ED, a negative-working electrodeposited photoresist. Electrical frontside to backside interconnections have been made using this photoresist as an etch mask

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ER -

Conformal coating by photoresist of sharp corners of anisotropically etched through-holes in silicon

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