Compressibility and thermal expansion of cubic silicon nitride

Jianzhong Jiang, H. Lindelov, Leif Gerward, Kenny Ståhl, R.M. Recio, P. Mori-Sanchez, S. Carlson, M. Mezouar, E. Dooryhee, A. Fitch, D.J. Frost

Research output: Contribution to journalJournal articleResearchpeer-review

752 Downloads (Pure)

Abstract

The compressibility and thermal expansion of the cubic silicon nitride (c-Si3N4) phase have been investigated by performing in situ x-ray powder-diffraction measurements using synchrotron radiation, complemented with computer simulations by means of first-principles calculations. The bulk compressibility of the c-Si3N4 phase originates from the average of both Si-N tetrahedral and octahedral compressibilities where the octahedral polyhedra are less compressible than the tetrahedral ones. The origin of the unit cell expansion is revealed to be due to the increase of the octahedral Si-N and N-N bond lengths with temperature, while the lengths for the tetrahedral Si-N and N-N bonds remain almost unchanged in the temperature range 295-1075 K.
Original languageEnglish
JournalPhysical Review B Condensed Matter
Volume65
Issue number16
Pages (from-to)161202
ISSN0163-1829
DOIs
Publication statusPublished - 2002

Bibliographical note

Copyright (2002) American Physical Society

Keywords

  • SPINEL PHASE
  • BETA-SI3N4
  • SI3N4

Fingerprint Dive into the research topics of 'Compressibility and thermal expansion of cubic silicon nitride'. Together they form a unique fingerprint.

Cite this