Comparison of Ultrasonic Welding and Thermal Bonding for the Integration of Thin Film Metal Electrodes in Injection Molded Polymeric Lab-on-Chip Systems for Electrochemistry

Marco Matteucci, Arto Heiskanen, Kinga Zor, Jenny Emnéus, Rafael J. Taboryski

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    Abstract

    We compare ultrasonic welding (UW) and thermal bonding (TB) for the integration of embedded thin-film gold electrodes for electrochemical applications in injection molded (IM) microfluidic chips. The UW bonded chips showed a significantly superior electrochemical performance compared to the ones obtained using TB. Parameters such as metal thickness of electrodes, depth of electrode embedding, delivered power, and height of energy directors (for UW), as well as pressure and temperature (for TB), were systematically studied to evaluate the two bonding methods and requirements for optimal electrochemical performance. The presented technology is intended for easy and effective integration of polymeric Lab-on-Chip systems to encourage their use in research, commercialization and education.
    Original languageEnglish
    Article number1795
    JournalSensors
    Volume16
    Issue number11
    Number of pages12
    ISSN1424-8220
    DOIs
    Publication statusPublished - 2016

    Keywords

    • Electrochemistry
    • Injection molding
    • Metal electrodes
    • Microfluidics
    • Ultrasonic welding

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