Comparison of processing-induced deformations of InP bonded to Si determined by e-beam metrology: Direct vs. adhesive bonding
- Aurimas Sakanas*
- , Elizaveta Semenova
- , Luisa Ottaviano
- , Jesper Mørk
- , Kresten Yvind
*Corresponding author for this work
- Alight Technologies ApS
Research output: Contribution to journal › Journal article › Research › peer-review
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