Colorimetric visualization of tin corrosion: A method for early stage corrosion detection on printed circuit boards

Research output: Contribution to journalJournal article – Annual report year: 2017Researchpeer-review

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Colorimetric visualization of tin corrosion: A method for early stage corrosion detection on printed circuit boards. / Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan.

In: Microelectronics Reliability, Vol. 73, 2017, p. 158-166.

Research output: Contribution to journalJournal article – Annual report year: 2017Researchpeer-review

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@article{65c2d6524f954796bef85c4fac763993,
title = "Colorimetric visualization of tin corrosion: A method for early stage corrosion detection on printed circuit boards",
abstract = "A majority of printed circuit board surfaces are covered with tin, therefore tin corrosion under humid conditions and movement of tin ions under the influence of an electric field plays an important role in the corrosion failure development. Tracking tin corrosion products spread on the printed circuit board assembly (PCBA) provides a basis for the mechanistic understanding of PCBA corrosion failures and leak current tracks which eventually can lead to electrochemical migration. This paper presents a method for identification of such failures at the early stage of corrosion by using a colorimetric tin ion indicator applied as a gel. The examples provided in this paper include visualization of corrosion caused by weak organic acids found in solder fluxes, corrosion profiling on the PCBAs after climatic device level testing, and failure analysis of field returns.",
keywords = "Electrochemical migration, Leakage current, Reliability, Surface insulation resistance, Testing, Tin corrosion, Humidity, Surface insulation resistances",
author = "Vadimas Verdingovas and Jellesen, {Morten Stendahl} and Rajan Ambat",
year = "2017",
doi = "10.1016/j.microrel.2017.05.005",
language = "English",
volume = "73",
pages = "158--166",
journal = "Microelectronics Reliability",
issn = "0026-2714",
publisher = "Pergamon Press",

}

RIS

TY - JOUR

T1 - Colorimetric visualization of tin corrosion: A method for early stage corrosion detection on printed circuit boards

AU - Verdingovas, Vadimas

AU - Jellesen, Morten Stendahl

AU - Ambat, Rajan

PY - 2017

Y1 - 2017

N2 - A majority of printed circuit board surfaces are covered with tin, therefore tin corrosion under humid conditions and movement of tin ions under the influence of an electric field plays an important role in the corrosion failure development. Tracking tin corrosion products spread on the printed circuit board assembly (PCBA) provides a basis for the mechanistic understanding of PCBA corrosion failures and leak current tracks which eventually can lead to electrochemical migration. This paper presents a method for identification of such failures at the early stage of corrosion by using a colorimetric tin ion indicator applied as a gel. The examples provided in this paper include visualization of corrosion caused by weak organic acids found in solder fluxes, corrosion profiling on the PCBAs after climatic device level testing, and failure analysis of field returns.

AB - A majority of printed circuit board surfaces are covered with tin, therefore tin corrosion under humid conditions and movement of tin ions under the influence of an electric field plays an important role in the corrosion failure development. Tracking tin corrosion products spread on the printed circuit board assembly (PCBA) provides a basis for the mechanistic understanding of PCBA corrosion failures and leak current tracks which eventually can lead to electrochemical migration. This paper presents a method for identification of such failures at the early stage of corrosion by using a colorimetric tin ion indicator applied as a gel. The examples provided in this paper include visualization of corrosion caused by weak organic acids found in solder fluxes, corrosion profiling on the PCBAs after climatic device level testing, and failure analysis of field returns.

KW - Electrochemical migration

KW - Leakage current

KW - Reliability

KW - Surface insulation resistance

KW - Testing

KW - Tin corrosion

KW - Humidity

KW - Surface insulation resistances

U2 - 10.1016/j.microrel.2017.05.005

DO - 10.1016/j.microrel.2017.05.005

M3 - Journal article

VL - 73

SP - 158

EP - 166

JO - Microelectronics Reliability

JF - Microelectronics Reliability

SN - 0026-2714

ER -