Abstract
Aim of this paper is to demonstrate the use of circuit analysis to predict humidity robustness of an electronic circuit design. There is a lack of design tools which can predict failures due to humidity, especially the effect of humidity on electrical functionality of circuits. This work provides a methodology for utilising circuit simulation tools to detect humidity related faults associated with a circuit design by using experimentally determined leakage current data or surface insulation resistance using test pattern or model circuits. Simulation of circuits was performed with the experimentally determined SIR value as a parasitic resistance across two nodes of the circuit. Commonly used circuits such as a differential amplifier and a non-inverting comparator were analysed by this methodology. Based on the analysis, circuits with higher humidity robustness have been suggested as examples to demonstrate the effectiveness of this methodology. Finally, the correlation between the properties of the water layer on SIR pattern and actual components was done, which further demonstrates the applicability of the methodology.
Original language | English |
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Journal | Microelectronics Reliability |
Volume | 93 |
Pages (from-to) | 81-88 |
Number of pages | 8 |
ISSN | 0026-2714 |
DOIs | |
Publication status | Published - 2019 |
Keywords
- Contamination
- Electronic circuit
- Humidity
- Leak current
- Surface insulation resistance
Cite this
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Circuit analysis to predict humidity related failures in electronics - Methodology and recommendations. / Joshy, Salil; Verdingovas, Vadimas; Jellesen, Morten Stendahl; Ambat, Rajan.
In: Microelectronics Reliability, Vol. 93, 2019, p. 81-88.Research output: Contribution to journal › Journal article › Research › peer-review
TY - JOUR
T1 - Circuit analysis to predict humidity related failures in electronics - Methodology and recommendations
AU - Joshy, Salil
AU - Verdingovas, Vadimas
AU - Jellesen, Morten Stendahl
AU - Ambat, Rajan
PY - 2019
Y1 - 2019
N2 - Aim of this paper is to demonstrate the use of circuit analysis to predict humidity robustness of an electronic circuit design. There is a lack of design tools which can predict failures due to humidity, especially the effect of humidity on electrical functionality of circuits. This work provides a methodology for utilising circuit simulation tools to detect humidity related faults associated with a circuit design by using experimentally determined leakage current data or surface insulation resistance using test pattern or model circuits. Simulation of circuits was performed with the experimentally determined SIR value as a parasitic resistance across two nodes of the circuit. Commonly used circuits such as a differential amplifier and a non-inverting comparator were analysed by this methodology. Based on the analysis, circuits with higher humidity robustness have been suggested as examples to demonstrate the effectiveness of this methodology. Finally, the correlation between the properties of the water layer on SIR pattern and actual components was done, which further demonstrates the applicability of the methodology.
AB - Aim of this paper is to demonstrate the use of circuit analysis to predict humidity robustness of an electronic circuit design. There is a lack of design tools which can predict failures due to humidity, especially the effect of humidity on electrical functionality of circuits. This work provides a methodology for utilising circuit simulation tools to detect humidity related faults associated with a circuit design by using experimentally determined leakage current data or surface insulation resistance using test pattern or model circuits. Simulation of circuits was performed with the experimentally determined SIR value as a parasitic resistance across two nodes of the circuit. Commonly used circuits such as a differential amplifier and a non-inverting comparator were analysed by this methodology. Based on the analysis, circuits with higher humidity robustness have been suggested as examples to demonstrate the effectiveness of this methodology. Finally, the correlation between the properties of the water layer on SIR pattern and actual components was done, which further demonstrates the applicability of the methodology.
KW - Contamination
KW - Electronic circuit
KW - Humidity
KW - Leak current
KW - Surface insulation resistance
U2 - 10.1016/j.microrel.2018.12.010
DO - 10.1016/j.microrel.2018.12.010
M3 - Journal article
VL - 93
SP - 81
EP - 88
JO - Microelectronics Reliability
JF - Microelectronics Reliability
SN - 0026-2714
ER -