Chip-to-chip quantum teleportation and multi-photon entanglement in silicon

Daniel Llewellyn, Yunhong Ding, Imad I. Faruque, Stefano Paesani, Davide Bacco, Raffaele Santagati, Yan Jun Qian, Yan Li, Yun Feng Xiao, Marcus Huber, Mehul Malik, Gary F. Sinclair, Xiaoqi Zhou, Karsten Rottwitt, Jeremy L. O’Brien, John G. Rarity, Qihuang Gong, Leif K. Oxenlowe, Jianwei Wang*, Mark G. Thompson

*Corresponding author for this work

Research output: Contribution to journalLetterResearchpeer-review

45 Downloads (Pure)

Abstract

Integrated optics provides a versatile platform for quantum information processing and transceiving with photons1–8. The implementation of quantum protocols requires the capability to generate multiple high-quality single photons and process photons with multiple high-fidelity operators9–11. However, previous experimental demonstrations were faced by major challenges in realizing sufficiently high-quality multi-photon sources and multi-qubit operators in a single integrated system4–8, and fully chip-based implementations of multi-qubit quantum tasks remain a significant challenge1–3. Here, we report the demonstration of chip-to-chip quantum teleportation and genuine multipartite entanglement, the core functionalities in quantum technologies, on silicon-photonic circuitry. Four single photons with high purity and indistinguishablity are produced in an array of microresonator sources, without requiring any spectral filtering. Up to four qubits are processed in a reprogrammable linear-optic quantum circuit that facilitates Bell projection and fusion operation. The generation, processing, transceiving and measurement of multi-photon multi-qubit states are all achieved in micrometre-scale silicon chips, fabricated by the complementary metal–oxide–semiconductor process. Our work lays the groundwork for large-scale integrated photonic quantum technologies for communications and computations.

Original languageEnglish
JournalNature Physics
Volume16
Issue number2
Pages (from-to)148-153
ISSN1745-2473
DOIs
Publication statusPublished - 1 Feb 2020

Cite this

Llewellyn, D., Ding, Y., Faruque, I. I., Paesani, S., Bacco, D., Santagati, R., Qian, Y. J., Li, Y., Xiao, Y. F., Huber, M., Malik, M., Sinclair, G. F., Zhou, X., Rottwitt, K., O’Brien, J. L., Rarity, J. G., Gong, Q., Oxenlowe, L. K., Wang, J., & Thompson, M. G. (2020). Chip-to-chip quantum teleportation and multi-photon entanglement in silicon. Nature Physics, 16(2), 148-153. https://doi.org/10.1038/s41567-019-0727-x