TY - JOUR
T1 - Chip-size-packaged silicon microphones [for hearing instruments]
AU - Müllenborn, Matthias
AU - Rombach, Pirmin
AU - Klein, Udo
AU - Rasmussen, K.
AU - Khuhmann, J. F.
AU - Heschel, Matthias
AU - Amskov Gravad, M.
AU - Janting, Jakob
AU - Branebjerg, Jens
AU - Hoogerwerf, A.
AU - Bouwstra, Siebe
PY - 2001
Y1 - 2001
N2 - The first results of silicon microphones that are completely batch-packaged and integrated with signal conditioning circuitry in a chip stack are discussed. The chip stack is designed to be directly mounted into a system, such as a hearing instrument, without further single-chip handling or wire bonding. The devices are fully encapsulated and provided with a well-determined interface to the environment. The integrated microphones operate at a bias of 1.5 V and are expected to reach a sensitivity of 5 mV/Pa, an A-weighted equivalent input noise of 24 dB sound pressure level, and a power consumption of about 50 μW in the near future, thereby living up to the tight specifications of microphones for hearing instruments. Other potential applications include mobile phones, headsets, and wearable computers, in which space is constrained.
AB - The first results of silicon microphones that are completely batch-packaged and integrated with signal conditioning circuitry in a chip stack are discussed. The chip stack is designed to be directly mounted into a system, such as a hearing instrument, without further single-chip handling or wire bonding. The devices are fully encapsulated and provided with a well-determined interface to the environment. The integrated microphones operate at a bias of 1.5 V and are expected to reach a sensitivity of 5 mV/Pa, an A-weighted equivalent input noise of 24 dB sound pressure level, and a power consumption of about 50 μW in the near future, thereby living up to the tight specifications of microphones for hearing instruments. Other potential applications include mobile phones, headsets, and wearable computers, in which space is constrained.
KW - Microphone
KW - Acoustiv transducers
KW - Stacking
KW - Packaging
M3 - Journal article
VL - A92
SP - 23
EP - 29
JO - Sensors and Actuators A: Physical
JF - Sensors and Actuators A: Physical
SN - 0924-4247
IS - 1-3
ER -