Chemical Vapor Deposition of 3C-SiC on [100] Oriented Silicon at low Temperature < 1200°C for Photonic Applications

M. Kollmuß, J. Köhler, H. Ou, W. Fan, D. Chaussende, R. Hock, P. J. Wellmann*

*Corresponding author for this work

Research output: Contribution to journalConference articleResearchpeer-review

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Abstract

3C-SiC films have been grown on [100] n-doped Si substrates in a horizontal cold wall CVD reactor. Without the use of plasma enhancement, the precursors silane and propane are used to deposit silicon carbide films at T < 1200°C. The structure of the grown films has been investigated via FESEM, XRD and Raman spectroscopy. It has been found that the growth rates are between 200 and 300 nm/h. Additionally, structural analysis give evidence of polycrystalline phases. Reasons for that could be insufficient cracking of the precursors and homogenous nucleation of Si species in the gas phase.

Original languageEnglish
JournalMaterials Science Forum
Volume1062
Pages (from-to)119-124
ISSN0255-5476
DOIs
Publication statusPublished - 2022
Event13th European Conference on Silicon Carbide and Related Materials - Vinci International Convention Centre, Tours, France
Duration: 24 Oct 202128 Oct 2021
https://www.ecscrm-2020.com

Conference

Conference13th European Conference on Silicon Carbide and Related Materials
LocationVinci International Convention Centre
Country/TerritoryFrance
CityTours
Period24/10/202128/10/2021
Internet address

Keywords

  • 3C-SiC
  • Cold wall reactor
  • CVD
  • Heteroepitaxy
  • Low temperature
  • Void

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