Abstract
The purity and morphology of the copper surface is important for the synthesis of high-quality, large-grained graphene by chemical vapor deposition. We find that atomically smooth copper foils─fabricated by physical vapor deposition and subsequent electroplating of copper on silicon wafer templates─exhibit strongly reduced surface roughness after the annealing of the copper catalyst, and correspondingly lower nucleation and defect density of the graphene film, when compared to commercial cold-rolled copper foils. The "ultrafoils"─ultraflat foils─facilitate easier dry pickup and encapsulation of graphene by hexagonal boron nitride, which we believe is due to the lower roughness of the catalyst surface promoting a conformal interface and subsequent stronger van der Waals adhesion between graphene and hexagonal boron nitride.
Original language | English |
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Journal | ACS Omega |
Volume | 7 |
Issue number | 26 |
Pages (from-to) | 22626-22632 |
DOIs | |
Publication status | Published - 2022 |