Characterization of MEMS Pressure Sensor Packaging Concept using O-rings as Hermetic Sealing

Casper Pedersen, Simon Tage Jespersen, K.W. Jacobsen, J.P. Krog, C. Christensen, Erik Vilain Thomsen

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

    Original languageEnglish
    Title of host publicationProceedings of the 17th European Conference on Solid-State Tranducers (Eurosensors)
    Publication date2003
    Pages418-421
    Publication statusPublished - 2003

    Cite this

    Pedersen, C., Jespersen, S. T., Jacobsen, K. W., Krog, J. P., Christensen, C., & Thomsen, E. V. (2003). Characterization of MEMS Pressure Sensor Packaging Concept using O-rings as Hermetic Sealing. In Proceedings of the 17th European Conference on Solid-State Tranducers (Eurosensors) (pp. 418-421)