Changes to microstructure and interlayer stress in annealed electrodeposited Cu-Ni multilayers as assessed using TEM and x-ray diffraction methods

C.J. Pickup; A. Horsewell; W.M. Stobbs

Changes to microstructure and interlayer stress in annealed electrodeposited Cu-Ni multilayers as assessed using TEM and x-ray diffraction methods

C.J. Pickup, A. Horsewell, W.M. Stobbs

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research

Original language	English
Title of host publication	Electron microscopy and analysis group conference
Place of Publication	Bristol
Publisher	IOP Publishing
Publication date	1995
Pages	499-502
Publication status	Published - 1995
Event	Electron Microscopy and Analysis Group conference - Birmingham, United Kingdom Duration: 13 Oct 1995 → 14 Oct 1995

Conference

Conference	Electron Microscopy and Analysis Group conference
Country/Territory	United Kingdom
City	Birmingham
Period	13/10/1995 → 14/10/1995

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@inproceedings{2e72872f206e4187bdc67f1db87b6ca8,

title = "Changes to microstructure and interlayer stress in annealed electrodeposited Cu-Ni multilayers as assessed using TEM and x-ray diffraction methods",

keywords = "Strukturelle materialer",

author = "C.J. Pickup and A. Horsewell and W.M. Stobbs",

year = "1995",

language = "English",

pages = "499--502",

booktitle = "Electron microscopy and analysis group conference",

publisher = "IOP Publishing",

address = "United Kingdom",

note = "Electron Microscopy and Analysis Group conference, EMAG '95 ; Conference date: 13-10-1995 Through 14-10-1995",

}

Pickup, CJ, Horsewell, A & Stobbs, WM 1995, Changes to microstructure and interlayer stress in annealed electrodeposited Cu-Ni multilayers as assessed using TEM and x-ray diffraction methods. in Electron microscopy and analysis group conference. IOP Publishing, Bristol, pp. 499-502, Electron Microscopy and Analysis Group conference, Birmingham, United Kingdom, 13/10/1995.

Changes to microstructure and interlayer stress in annealed electrodeposited Cu-Ni multilayers as assessed using TEM and x-ray diffraction methods. / Pickup, C.J.; Horsewell, A.; Stobbs, W.M.
Electron microscopy and analysis group conference. Bristol: IOP Publishing, 1995. p. 499-502.

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research

TY - GEN

T1 - Changes to microstructure and interlayer stress in annealed electrodeposited Cu-Ni multilayers as assessed using TEM and x-ray diffraction methods

AU - Pickup, C.J.

AU - Horsewell, A.

AU - Stobbs, W.M.

PY - 1995

Y1 - 1995

KW - Strukturelle materialer

M3 - Article in proceedings

SP - 499

EP - 502

BT - Electron microscopy and analysis group conference

PB - IOP Publishing

CY - Bristol

T2 - Electron Microscopy and Analysis Group conference

Y2 - 13 October 1995 through 14 October 1995

ER -