Changes to microstructure and interlayer stress in annealed electrodeposited Cu-Ni multilayers as assessed using TEM and x-ray diffraction methods

C.J. Pickup, A. Horsewell, W.M. Stobbs

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearch

    Original languageEnglish
    Title of host publicationElectron microscopy and analysis group conference
    Place of PublicationBristol
    PublisherIOP Publishing
    Publication date1995
    Pages499-502
    Publication statusPublished - 1995
    EventEMAG '95 - Birmingham (GB), 13-14 Sep
    Duration: 1 Jan 1995 → …

    Conference

    ConferenceEMAG '95
    CityBirmingham (GB), 13-14 Sep
    Period01/01/1995 → …
    SeriesInstitute of Physics Conference Series, 147, section 11

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