Centrifugal and hydroplaning phenomena in high-speed polishing

Wu Le Zhu; Soufian Ben Achour; Anthony Beaucamp

doi:10.1016/j.cirp.2019.04.018

Centrifugal and hydroplaning phenomena in high-speed polishing

Wu Le Zhu, Soufian Ben Achour, Anthony Beaucamp^*

^*Corresponding author for this work

Kyoto University

Research output: Contribution to journal › Journal article › Research › peer-review

Abstract

Super fine polishing with compliant tools can achieve nanoscale roughness, but has limited productivity due to low material removal rate (MRR). Increased spindle speed in high-speed polishing (HSP) might increase MRR, but significant challenges appear above 10,000 rpm because of centrifugal deformation of the tool and pad lifting due to hydroplaning phenomenon. Here, a tool offset compensation strategy is proposed for centrifugal deformation and novel pad patterning design that mitigates hydroplaning. Through this new approach, linear increase in MRR for spindle speed up to 24,000 rpm is demonstrated. This work lays the foundation for future developments of HSP in fabrication of ultraprecision optics.

Original language	English
Journal	CIRP Annals
Volume	68
Issue number	1
Pages (from-to)	369-372
ISSN	0007-8506
DOIs	https://doi.org/10.1016/j.cirp.2019.04.018
Publication status	Published - 2019

Keywords

High-speed polishing
Material removal
Ultra precision

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title = "Centrifugal and hydroplaning phenomena in high-speed polishing",

abstract = "Super fine polishing with compliant tools can achieve nanoscale roughness, but has limited productivity due to low material removal rate (MRR). Increased spindle speed in high-speed polishing (HSP) might increase MRR, but significant challenges appear above 10,000 rpm because of centrifugal deformation of the tool and pad lifting due to hydroplaning phenomenon. Here, a tool offset compensation strategy is proposed for centrifugal deformation and novel pad patterning design that mitigates hydroplaning. Through this new approach, linear increase in MRR for spindle speed up to 24,000 rpm is demonstrated. This work lays the foundation for future developments of HSP in fabrication of ultraprecision optics.",

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AU - Zhu, Wu Le

AU - Ben Achour, Soufian

AU - Beaucamp, Anthony

PY - 2019

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N2 - Super fine polishing with compliant tools can achieve nanoscale roughness, but has limited productivity due to low material removal rate (MRR). Increased spindle speed in high-speed polishing (HSP) might increase MRR, but significant challenges appear above 10,000 rpm because of centrifugal deformation of the tool and pad lifting due to hydroplaning phenomenon. Here, a tool offset compensation strategy is proposed for centrifugal deformation and novel pad patterning design that mitigates hydroplaning. Through this new approach, linear increase in MRR for spindle speed up to 24,000 rpm is demonstrated. This work lays the foundation for future developments of HSP in fabrication of ultraprecision optics.

AB - Super fine polishing with compliant tools can achieve nanoscale roughness, but has limited productivity due to low material removal rate (MRR). Increased spindle speed in high-speed polishing (HSP) might increase MRR, but significant challenges appear above 10,000 rpm because of centrifugal deformation of the tool and pad lifting due to hydroplaning phenomenon. Here, a tool offset compensation strategy is proposed for centrifugal deformation and novel pad patterning design that mitigates hydroplaning. Through this new approach, linear increase in MRR for spindle speed up to 24,000 rpm is demonstrated. This work lays the foundation for future developments of HSP in fabrication of ultraprecision optics.

KW - High-speed polishing

KW - Material removal

KW - Ultra precision

U2 - 10.1016/j.cirp.2019.04.018

DO - 10.1016/j.cirp.2019.04.018

M3 - Journal article

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VL - 68

SP - 369

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JO - CIRP Annals

JF - CIRP Annals

IS - 1

ER -

Centrifugal and hydroplaning phenomena in high-speed polishing

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