Abstract
Electrochemical measurements were carried out simultaneously with acquisition of in situ STM images
of copper electrodeposition at low cathodic overpotentials and subsequent dissolution from the underlying
polycrystalline gold surfaces. The morphologies of the copper deposits were examined for correlation
with features of the current-voltage diagram. Copper growth is by nucleation and formation
of 3D islands. During the initial stages of bulk copper growth the potentials were fixed at selected
values and a balance observed between formation of polycrystalline copper nuclei and of copper crystals.
After the first cycle of copper deposition and dissolution the morphology of the polycrystalline
gold surface had apparently changed into a recrystallized phase of a copper-gold alloy. At a given
stage of the cycle the potential of the electrode was found to depend linearly on the tip potential.
In a wide range of tip potentials the onset of copper deposition and end of dissolution showed a potential
separation of 59 4- 5 mV indicating a single electron process.
Original language | English |
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Journal | Journal of Applied Electrochemistry |
Volume | 26 |
Issue number | 2 |
Pages (from-to) | 161-170 |
ISSN | 0021-891X |
DOIs | |
Publication status | Published - 1996 |