Bubble formation at grain boundaries in helium implanted copper

P.A. Thorsen, Jørgen Bilde-Sørensen, B.N. Singh

    Research output: Contribution to journalJournal articleResearchpeer-review

    Original languageEnglish
    JournalScripta Materialia
    Volume51
    Pages (from-to)557-560
    ISSN1359-6462
    DOIs
    Publication statusPublished - 2004

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