Boundary migration during recrystallization of heavily deformed pure nickel

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Abstract

The detailed microstructure in front of recrystallization boundaries and their migration during annealing were traced using ex-situ electron backscatter pattern maps of one and the same surface area taken after annealing. It is observed that many protrusions/detrusions form on the recrystallizing boundaries. During annealing, the recrystallization boundary segments migrate in a stop-go type of fashion, while protrusions and detrusions alternately form and disappear. The
correlation between the protrusions/detrusions and the stop-go type of migration are briefly discussed.
Original languageEnglish
JournalMaterials Science Forum
Volume715-716
Pages (from-to)329-332
ISSN0255-5476
DOIs
Publication statusPublished - 2012
Event4th International Conference on Recrystallization and Grain Growth - Sheffield, United Kingdom
Duration: 4 Jul 20109 Jul 2010

Conference

Conference4th International Conference on Recrystallization and Grain Growth
Country/TerritoryUnited Kingdom
CitySheffield
Period04/07/201009/07/2010

Keywords

  • Boundary migration
  • Protrusions
  • Electron backscattered pattern (EBSP)
  • Nickel

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