Boundary migration during recrystallization of heavily deformed pure nickel

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    Abstract

    The detailed microstructure in front of recrystallization boundaries and their migration during annealing were traced using ex-situ electron backscatter pattern maps of one and the same surface area taken after annealing. It is observed that many protrusions/detrusions form on the recrystallizing boundaries. During annealing, the recrystallization boundary segments migrate in a stop-go type of fashion, while protrusions and detrusions alternately form and disappear. The
    correlation between the protrusions/detrusions and the stop-go type of migration are briefly discussed.
    Original languageEnglish
    JournalMaterials Science Forum
    Volume715-716
    Pages (from-to)329-332
    ISSN0255-5476
    DOIs
    Publication statusPublished - 2012
    Event4th International Conference on Recrystallization and Grain Growth - Sheffield, United Kingdom
    Duration: 4 Jul 20109 Jul 2010

    Conference

    Conference4th International Conference on Recrystallization and Grain Growth
    Country/TerritoryUnited Kingdom
    CitySheffield
    Period04/07/201009/07/2010

    Keywords

    • Boundary migration
    • Protrusions
    • Electron backscattered pattern (EBSP)
    • Nickel

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