Bondwire array modeling for the design of hybrid high power amplifiers above C-band

Carlos Cilla Hernández, Sævar Þór Jónasson, Jesper Hanberg

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Abstract

This paper presents a bondwire array model obtained using a software based on the finite elements method and validated up to 15 GHz by measurements over a purpose-build array structure. This work addresses the limits of the inductor-based bondwire model when used at frequencies above C-band to simulate the large bondwire arrays that are used in long multi-transistor power bars. The usefulness of an accurate 3D EM model during the amplifier's matching network design process is highlighted using a practical example, and the effect of the insertion loss variations along the different bondwires comprising the array on the hybrid performance is discussed.
Original languageEnglish
Title of host publicationProceedings of 2012 Asia-Pacific Microwave Conference (APMC)
PublisherIEEE
Publication date2012
Pages851-853
Chapter4A2-03
ISBN (Print)978-1-4577-1330-9
ISBN (Electronic)978-1-4577-1331-6
DOIs
Publication statusPublished - 2012
Event 2012 Asia-Pacific Microwave Conference (APMC) - Kaohsiung, Taiwan, Province of China
Duration: 4 Dec 20127 Dec 2012

Conference

Conference 2012 Asia-Pacific Microwave Conference (APMC)
CountryTaiwan, Province of China
CityKaohsiung
Period04/12/201207/12/2012

Keywords

  • High power amplifier
  • Hybrid integrated circuits
  • Integrated circuit packaging
  • Power transistors
  • Semiconductor device packaging
  • Wafer bonding

Cite this

Hernández, C. C., Jónasson, S. Þ., & Hanberg, J. (2012). Bondwire array modeling for the design of hybrid high power amplifiers above C-band. In Proceedings of 2012 Asia-Pacific Microwave Conference (APMC) (pp. 851-853). IEEE. https://doi.org/10.1109/APMC.2012.6421756