Batch Fabrication of Through-Wafer Vias In CMOS Wafers for 3-D Packaging Applications

Frank Engel Rasmussen, M. Heschel, Ole Hansen

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

    465 Downloads (Pure)
    Original languageEnglish
    Title of host publicationProceedings of the 53rd Electronic Components and Technology Conference (ECTC)
    Publication date2003
    Pages634-639
    ISBN (Print)0-7803-7791-5
    Publication statusPublished - 2003
    Event53rd Electronic Components and Technology Conference - New Orleans, United States
    Duration: 27 May 200330 May 2003
    Conference number: 53

    Conference

    Conference53rd Electronic Components and Technology Conference
    Number53
    Country/TerritoryUnited States
    CityNew Orleans
    Period27/05/200330/05/2003

    Bibliographical note

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