Batch Fabrication of Through-Wafer Vias In CMOS Wafers for 3-D Packaging Applications

Frank Engel Rasmussen; M. Heschel; Ole Hansen

Batch Fabrication of Through-Wafer Vias In CMOS Wafers for 3-D Packaging Applications

Frank Engel Rasmussen, M. Heschel, Ole Hansen

Research output: Chapter in Book/Report/Conference proceeding › Article in proceedings › Research › peer-review

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Original language	English
Title of host publication	Proceedings of the 53rd Electronic Components and Technology Conference (ECTC)
Publication date	2003
Pages	634-639
ISBN (Print)	0-7803-7791-5
Publication status	Published - 2003
Event	53rd Electronic Components and Technology Conference - New Orleans, United States Duration: 27 May 2003 → 30 May 2003 Conference number: 53

Conference

Conference	53rd Electronic Components and Technology Conference
Number	53
Country/Territory	United States
City	New Orleans
Period	27/05/2003 → 30/05/2003

Bibliographical note

Copyright: 2003 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE

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title = "Batch Fabrication of Through-Wafer Vias In CMOS Wafers for 3-D Packaging Applications",

author = "Rasmussen, {Frank Engel} and M. Heschel and Ole Hansen",

note = "Copyright: 2003 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE; 53rd Electronic Components and Technology Conference, ECTC ; Conference date: 27-05-2003 Through 30-05-2003",

year = "2003",

language = "English",

isbn = "0-7803-7791-5",

pages = "634--639",

booktitle = "Proceedings of the 53rd Electronic Components and Technology Conference (ECTC)",

}

TY - GEN

T1 - Batch Fabrication of Through-Wafer Vias In CMOS Wafers for 3-D Packaging Applications

AU - Rasmussen, Frank Engel

AU - Heschel, M.

AU - Hansen, Ole

N1 - Conference code: 53

PY - 2003

Y1 - 2003

M3 - Article in proceedings

SN - 0-7803-7791-5

SP - 634

EP - 639

BT - Proceedings of the 53rd Electronic Components and Technology Conference (ECTC)

T2 - 53rd Electronic Components and Technology Conference

Y2 - 27 May 2003 through 30 May 2003

ER -