Batch Fabrication of Through-Wafer Vias In CMOS Wafers for 3-D Packaging Applications

Frank Engel Rasmussen, M. Heschel, Ole Hansen

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

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    Original languageEnglish
    Title of host publicationProceedings of the 53rd Electronic Components and Technology Conference (ECTC)
    Publication date2003
    Pages634-639
    ISBN (Print)0-7803-7791-5
    Publication statusPublished - 2003
    Event53rd Electronic Components and Technology Conference -
    Duration: 1 Jan 2003 → …

    Conference

    Conference53rd Electronic Components and Technology Conference
    Period01/01/2003 → …

    Bibliographical note

    Copyright: 2003 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE

    Cite this

    Rasmussen, F. E., Heschel, M., & Hansen, O. (2003). Batch Fabrication of Through-Wafer Vias In CMOS Wafers for 3-D Packaging Applications. In Proceedings of the 53rd Electronic Components and Technology Conference (ECTC) (pp. 634-639)