Batch Fabrication of Through-Wafer Vias In CMOS Wafers for 3-D Packaging Applications

Frank Engel Rasmussen, M. Heschel, Ole Hansen

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

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    Original languageEnglish
    Title of host publicationProceedings of the 53rd Electronic Components and Technology Conference (ECTC)
    Publication date2003
    ISBN (Print)0-7803-7791-5
    Publication statusPublished - 2003
    Event53rd Electronic Components and Technology Conference -
    Duration: 1 Jan 2003 → …


    Conference53rd Electronic Components and Technology Conference
    Period01/01/2003 → …

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