Atomic layer process printer

Maksym Plakhotnyuk; Ole Hansen; Boisen Anja; Tomas Rindzevicius; Ivan Kundrata; Karol Fröhlich; Julien Bachmann

Atomic layer process printer

Maksym Plakhotnyuk (Inventor)
, Ole Hansen (Inventor)
, Boisen Anja (Inventor)
, Tomas Rindzevicius (Inventor)
, Ivan Kundrata (Inventor)
, Karol Fröhlich (Inventor)
, Julien Bachmann (Inventor)

Research output: Patent

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Abstract

The invention relates to an atomic layer process printer for material deposition, etching and/or cleaning on an atomic scale in a selective area. The invention further relates to a method for material deposition, etching and/or cleaning on an atomic scale in a selective area using the atomic layer process printer.

Original language	English
IPC	C23C 16/ 455 A I
Patent number	WO2020245230
Filing date	03/06/2020
Country/Territory	International Bureau of the World Intellectual Property Organization (WIPO)
Priority date	04/06/2019
Priority number	EP20190178248
Publication status	Published - 10 Dec 2020

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title = "Atomic layer process printer",

abstract = "The invention relates to an atomic layer process printer for material deposition, etching and/or cleaning on an atomic scale in a selective area. The invention further relates to a method for material deposition, etching and/or cleaning on an atomic scale in a selective area using the atomic layer process printer.",

author = "Maksym Plakhotnyuk and Ole Hansen and Boisen Anja and Tomas Rindzevicius and Ivan Kundrata and Karol Fr{\"o}hlich and Julien Bachmann",

year = "2020",

month = dec,

day = "10",

language = "English",

type = "Patent",

note = "WO2020245230; C23C 16/ 455 A I",

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TY - PAT

T1 - Atomic layer process printer

AU - Plakhotnyuk, Maksym

AU - Hansen, Ole

AU - Anja, Boisen

AU - Rindzevicius, Tomas

AU - Kundrata, Ivan

AU - Fröhlich, Karol

AU - Bachmann, Julien

PY - 2020/12/10

Y1 - 2020/12/10

N2 - The invention relates to an atomic layer process printer for material deposition, etching and/or cleaning on an atomic scale in a selective area. The invention further relates to a method for material deposition, etching and/or cleaning on an atomic scale in a selective area using the atomic layer process printer.

AB - The invention relates to an atomic layer process printer for material deposition, etching and/or cleaning on an atomic scale in a selective area. The invention further relates to a method for material deposition, etching and/or cleaning on an atomic scale in a selective area using the atomic layer process printer.

M3 - Patent

M1 - WO2020245230

Y2 - 2020/06/03

ER -

Atomic layer process printer

Abstract

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