Assesment of (Mn,Co)3O4 powders for possible coating material for SOFC/SOEC interconnects

D. Szymczewska, Sebastian Molin, Vinothini Venkatachalam, Ming Chen, P. Jasinski, Peter Vang Hendriksen

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Abstract

In this work (Mn,Co)3O4 spinel powders with different Mn:Co ratio (1:1 and 1:2) and from different commercial suppliers are evaluated for possible powder for production of interconnect coatings. Sinterability of the powders is evaluated on pressed pellets sintered in oxidizing and in reducing/oxidizing atmospheres. For selected powder, coatings are then prepared by the electrophoretic deposition method on Crofer 22 APU stainless steel coupons. Effects of dispersant/iodine content and deposition voltage and times are evaluated. Thickness as a function of deposition parameters is described. Results show that with appropriate powder it is possible to produce adherent protective coating with a well-controlled thickness.
Original languageEnglish
Article number012017
JournalI O P Conference Series: Materials Science and Engineering
Volume104
Number of pages9
ISSN1757-8981
DOIs
Publication statusPublished - 2015
Event39th International Microelectronics and Packaging Conference - Gdansk, Poland
Duration: 20 Sep 201523 Sep 2015
Conference number: 39

Conference

Conference39th International Microelectronics and Packaging Conference
Number39
CountryPoland
CityGdansk
Period20/09/201523/09/2015

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