Assesment of (Mn,Co)3O4 powders for possible coating material for SOFC/SOEC interconnects

D. Szymczewska; Sebastian Molin; Vinothini Venkatachalam; Ming Chen; P. Jasinski; Peter Vang Hendriksen

doi:10.1088/1757-899X/104/1/012017

Assesment of (Mn,Co)₃O₄ powders for possible coating material for SOFC/SOEC interconnects

D. Szymczewska, Sebastian Molin, Vinothini Venkatachalam, Ming Chen, P. Jasinski, Peter Vang Hendriksen

Department of Energy Conversion and Storage

Gdańsk University of Technology

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Abstract

In this work (Mn,Co)₃O₄ spinel powders with different Mn:Co ratio (1:1 and 1:2) and from different commercial suppliers are evaluated for possible powder for production of interconnect coatings. Sinterability of the powders is evaluated on pressed pellets sintered in oxidizing and in reducing/oxidizing atmospheres. For selected powder, coatings are then prepared by the electrophoretic deposition method on Crofer 22 APU stainless steel coupons. Effects of dispersant/iodine content and deposition voltage and times are evaluated. Thickness as a function of deposition parameters is described. Results show that with appropriate powder it is possible to produce adherent protective coating with a well-controlled thickness.

Original language	English
Article number	012017
Journal	I O P Conference Series: Materials Science and Engineering
Volume	104
Number of pages	9
ISSN	1757-8981
DOIs	https://doi.org/10.1088/1757-899X/104/1/012017
Publication status	Published - 2015
Event	39th International Microelectronics and Packaging Conference - Gdansk, Poland Duration: 20 Sept 2015 → 23 Sept 2015 Conference number: 39

Conference

Conference	39th International Microelectronics and Packaging Conference
Number	39
Country/Territory	Poland
City	Gdansk
Period	20/09/2015 → 23/09/2015

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10.1088/1757-899X/104/1/012017

Assesment of Mn CoFinal published version, 1.45 MB

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title = "Assesment of (Mn,Co)3O4 powders for possible coating material for SOFC/SOEC interconnects",

abstract = "In this work (Mn,Co)3O4 spinel powders with different Mn:Co ratio (1:1 and 1:2) and from different commercial suppliers are evaluated for possible powder for production of interconnect coatings. Sinterability of the powders is evaluated on pressed pellets sintered in oxidizing and in reducing/oxidizing atmospheres. For selected powder, coatings are then prepared by the electrophoretic deposition method on Crofer 22 APU stainless steel coupons. Effects of dispersant/iodine content and deposition voltage and times are evaluated. Thickness as a function of deposition parameters is described. Results show that with appropriate powder it is possible to produce adherent protective coating with a well-controlled thickness.",

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T1 - Assesment of (Mn,Co)3O4 powders for possible coating material for SOFC/SOEC interconnects

AU - Szymczewska, D.

AU - Molin, Sebastian

AU - Venkatachalam, Vinothini

AU - Chen, Ming

AU - Jasinski, P.

AU - Hendriksen, Peter Vang

N1 - Conference code: 39

PY - 2015

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N2 - In this work (Mn,Co)3O4 spinel powders with different Mn:Co ratio (1:1 and 1:2) and from different commercial suppliers are evaluated for possible powder for production of interconnect coatings. Sinterability of the powders is evaluated on pressed pellets sintered in oxidizing and in reducing/oxidizing atmospheres. For selected powder, coatings are then prepared by the electrophoretic deposition method on Crofer 22 APU stainless steel coupons. Effects of dispersant/iodine content and deposition voltage and times are evaluated. Thickness as a function of deposition parameters is described. Results show that with appropriate powder it is possible to produce adherent protective coating with a well-controlled thickness.

AB - In this work (Mn,Co)3O4 spinel powders with different Mn:Co ratio (1:1 and 1:2) and from different commercial suppliers are evaluated for possible powder for production of interconnect coatings. Sinterability of the powders is evaluated on pressed pellets sintered in oxidizing and in reducing/oxidizing atmospheres. For selected powder, coatings are then prepared by the electrophoretic deposition method on Crofer 22 APU stainless steel coupons. Effects of dispersant/iodine content and deposition voltage and times are evaluated. Thickness as a function of deposition parameters is described. Results show that with appropriate powder it is possible to produce adherent protective coating with a well-controlled thickness.

U2 - 10.1088/1757-899X/104/1/012017

DO - 10.1088/1757-899X/104/1/012017

M3 - Journal article

SN - 1757-8981

VL - 104

JO - I O P Conference Series: Materials Science and Engineering

JF - I O P Conference Series: Materials Science and Engineering

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T2 - 39th International Microelectronics and Packaging Conference

Y2 - 20 September 2015 through 23 September 2015

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