Analysis of Cavity Pressure and Warpage of Polyoxymethylene Thin Walled Injection Molded Parts: Experiments and Simulations

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    Abstract

    Process analysis and simulations on molding experiments of 3D thin shell parts have been conducted. Moldings were carried out with polyoxymethylene (POM). The moldings were performed with cavity pressure sensors in order to compare experimental process results with simulations. The warpage was characterized by measuring distances using a tactile coordinate measuring machine (CMM). Molding simulations have been executed taking into account actual processing conditions. Various aspects have been considered in the simulation: machine barrel geometry, injection speed profiles, cavity injection pressure, melt and mold temperatures, material rheological and pvT characterization. Factors investigated for comparisons were: injection pressure profile, short shots length, flow pattern, and warpage. A reliable molding experimental database was obtained, accurate simulations were conducted and a number of conclusions concerning improvements to simulation accuracy are presented regarding: pvT data, mesh, short shots, cavity pressure for process control validation as well as molding machine geometry modelling. Eventually, a methodology for improved molding simulations of cavity injection pressure, filling pattern and warpage was established.
    Original languageEnglish
    Article number110006
    JournalA I P Conference Proceedings Series
    Volume1664
    Number of pages5
    ISSN0094-243X
    DOIs
    Publication statusPublished - 2014
    Event30th International Conference of the Polymer Processing Society - Cleveland, OH, United States
    Duration: 8 Jun 201412 Jun 2014
    Conference number: 30
    http://www.pps30.com/

    Conference

    Conference30th International Conference of the Polymer Processing Society
    Number30
    Country/TerritoryUnited States
    CityCleveland, OH
    Period08/06/201412/06/2014
    Internet address

    Keywords

    • Thin-wall injection molding
    • Process simulation
    • Warpage
    • Optimization

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