Analysis and Comparison Based on Component Stress Factor of Dual Active Bridge and Isolated Full Bridge Boost Converters for Bidirectional Fuel Cells Systems

Riccardo Pittini, Maria del Carmen Mira Albert, Zhe Zhang, Arnold Knott, Michael A. E. Andersen

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Abstract

This paper presents an analysis and comparison of isolated topologies for bidirectional fuel cell systems. The analyzed topologies are the dua l active bridge (DAB) and the isolated full bridge boost converter (IFBBC). The analysis is performed based on the component stress factor (CSF). Results highlight that the DAB has lower CSF than the IFBBC for narrow converter operating points. On the other hand the IFBBC presents a more homogeneous CSF over the entire converter operating range. Finally, experimental results obtained from a 30-80 V 80 A 6 kW 40 kHz IFBBC are presented. The converter achieves efficiencies up to 98.2% and 97.45% depending on the converter power flow.
Original languageEnglish
Title of host publicationProceedings of IEEE International Power Electronics and Application Conference and Exposition
PublisherIEEE
Publication date2014
Pages1026-1031
ISBN (Print)978-1-4799-6768-1
Publication statusPublished - 2014
EventIEEE International Power Electronics and Application Conference and Exposition - Holiday Inn Shanghai Pudong Kangqiao, Shanghai, China
Duration: 5 Nov 20148 Nov 2014

Conference

ConferenceIEEE International Power Electronics and Application Conference and Exposition
LocationHoliday Inn Shanghai Pudong Kangqiao
CountryChina
CityShanghai
Period05/11/201408/11/2014

Keywords

  • Dual Active Bridge (DAB)
  • Isolated full Bridge Boost Converter (IFBBC)
  • Component Stress Factor (CSF)
  • High Efficiency
  • Bidirectional Fuel Cells

Cite this

Pittini, R., Mira Albert, M. D. C., Zhang, Z., Knott, A., & Andersen, M. A. E. (2014). Analysis and Comparison Based on Component Stress Factor of Dual Active Bridge and Isolated Full Bridge Boost Converters for Bidirectional Fuel Cells Systems. In Proceedings of IEEE International Power Electronics and Application Conference and Exposition (pp. 1026-1031). IEEE.