Abstract
The miniaturization of electronic systems and the explosive increase in their usage has increased the
climatic reliability issues of electronics devices and components especially having metal/alloys
parts exposed on t
he Printed Circuit Board Assembly (PCBA) surface or embedded within the
multi
-
layer laminate. Problems are compounded by the fact that these systems are built by multi
-
material combinations and additional accelerating factors such as corrosion causing proc
ess related
residues, bias voltage, and unpredictable user environment. Demand for miniaturised device has
resulted in higher density packing with reduction in component size and closer spacing thereby
increasing the electric field, while thinner metallic
parts needs only nano
-
grams levels of metal loss
for causing corrosion failures.
This paper provides an overview of the climatic reliability issues of electronic devices and
components with a focus on the metals/alloys usage on PCBA surface together with
cleanliness
issues, humidity interaction on PCBA surface, and PCBA design and device design aspects. Some
aspects related to device and enclosure design will also be considered.
Original language | English |
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Title of host publication | Proceedings of the IMAPS Nordic Annual Conference 2014 |
Number of pages | 1 |
Publication date | 2014 |
Publication status | Published - 2014 |
Event | IMAPS Nordic Annual Conference 2014 - Oulu, Finland Duration: 9 Jun 2014 → 11 Jun 2014 |
Conference
Conference | IMAPS Nordic Annual Conference 2014 |
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Country/Territory | Finland |
City | Oulu |
Period | 09/06/2014 → 11/06/2014 |