An open letter to members of the IEEE Dielectrics and Electrical Insulation Society

Len Dissado; Christian Laurent; Gian Carlo Montanari; Noriyuki Shimizu; John Fothergill; Paul Lewin; Yasuo Sekii; Keith Nelson; John Densley; Peter Morshuis; Simon Rowland; Reimund Gerhard; Tatsuki Okamoto; Mike Arnold; Gary Stevens; Alun Vaughan; Kaori Fukunaga; George Chen; Elizabeth da Silva; Tony Fouracre; J.T. Holboll

doi:10.1109/MEI.2008.4635654

An open letter to members of the IEEE Dielectrics and Electrical Insulation Society

Len Dissado, Christian Laurent, Gian Carlo Montanari, Noriyuki Shimizu, John Fothergill, Paul Lewin, Yasuo Sekii, Keith Nelson, John Densley, Peter Morshuis, Simon Rowland, Reimund Gerhard, Tatsuki Okamoto, Mike Arnold, Gary Stevens, Alun Vaughan, Kaori Fukunaga, George Chen, Elizabeth da Silva, Tony FouracreJ.T. Holboll

Research output: Contribution to journal › Journal article › Research › peer-review

Original language	English
Journal	IEEE Electrical Insulation Magazine
Volume	24
Issue number	5
Pages (from-to)	4-4
ISSN	0883-7554
DOIs	https://doi.org/10.1109/MEI.2008.4635654
Publication status	Published - 2008

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Dissado, L., Laurent, C., Montanari, G. C., Shimizu, N., Fothergill, J., Lewin, P., Sekii, Y., Nelson, K., Densley, J., Morshuis, P., Rowland, S., Gerhard, R., Okamoto, T., Arnold, M., Stevens, G., Vaughan, A., Fukunaga, K., Chen, G., da Silva, E., ... Holboll, J. T. (2008). An open letter to members of the IEEE Dielectrics and Electrical Insulation Society. IEEE Electrical Insulation Magazine, 24(5), 4-4. https://doi.org/10.1109/MEI.2008.4635654

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title = "An open letter to members of the IEEE Dielectrics and Electrical Insulation Society",

author = "Len Dissado and Christian Laurent and Montanari, {Gian Carlo} and Noriyuki Shimizu and John Fothergill and Paul Lewin and Yasuo Sekii and Keith Nelson and John Densley and Peter Morshuis and Simon Rowland and Reimund Gerhard and Tatsuki Okamoto and Mike Arnold and Gary Stevens and Alun Vaughan and Kaori Fukunaga and George Chen and {da Silva}, Elizabeth and Tony Fouracre and J.T. Holboll",

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Dissado, L, Laurent, C, Montanari, GC, Shimizu, N, Fothergill, J, Lewin, P, Sekii, Y, Nelson, K, Densley, J, Morshuis, P, Rowland, S, Gerhard, R, Okamoto, T, Arnold, M, Stevens, G, Vaughan, A, Fukunaga, K, Chen, G, da Silva, E, Fouracre, T & Holboll, JT 2008, 'An open letter to members of the IEEE Dielectrics and Electrical Insulation Society', IEEE Electrical Insulation Magazine, vol. 24, no. 5, pp. 4-4. https://doi.org/10.1109/MEI.2008.4635654

TY - JOUR

T1 - An open letter to members of the IEEE Dielectrics and Electrical Insulation Society

AU - Dissado, Len

AU - Laurent, Christian

AU - Montanari, Gian Carlo

AU - Shimizu, Noriyuki

AU - Fothergill, John

AU - Lewin, Paul

AU - Sekii, Yasuo

AU - Nelson, Keith

AU - Densley, John

AU - Morshuis, Peter

AU - Rowland, Simon

AU - Gerhard, Reimund

AU - Okamoto, Tatsuki

AU - Arnold, Mike

AU - Stevens, Gary

AU - Vaughan, Alun

AU - Fukunaga, Kaori

AU - Chen, George

AU - da Silva, Elizabeth

AU - Fouracre, Tony

AU - Holboll, J.T.

PY - 2008

Y1 - 2008

U2 - 10.1109/MEI.2008.4635654

DO - 10.1109/MEI.2008.4635654

M3 - Journal article

SN - 0883-7554

VL - 24

SP - 4

EP - 4

JO - IEEE Electrical Insulation Magazine

JF - IEEE Electrical Insulation Magazine

IS - 5

ER -