@inproceedings{9d88911b68784e84b7ac99d0e57d1ccb,
title = "An Experimental Investigation of Diffusion within Electroplated Lead-free Solder Alloy Stacks Combining Elements such as Sn, Cu, Au and/or Zn onto a Ni UBM",
author = "Ren{\'e} Bergmann and Io Mizushima and Tang, \{Peter Torben\} and Hansen, \{Hans N{\o}rgaard\}",
year = "2008",
language = "English",
booktitle = "Proceeding of IMAPS NORDIC Conference 2008",
publisher = "International Microelectronics and packaging Society",
note = "IMAPS NORDIC Conference ; Conference date: 01-01-2008",
}