An Experimental Investigation of Diffusion within Electroplated Lead-free Solder Alloy Stacks Combining Elements such as Sn, Cu, Au and/or Zn onto a Ni UBM

René Bergmann, Io Mizushima, Peter Torben Tang, Hans Nørgaard Hansen

    Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

    Original languageEnglish
    Title of host publicationProceeding of IMAPS NORDIC Conference 2008
    PublisherInternational Microelectronics and packaging Society
    Publication date2008
    Publication statusPublished - 2008
    EventIMAPS NORDIC Conference - Helsingør, Denmark
    Duration: 1 Jan 2008 → …


    ConferenceIMAPS NORDIC Conference
    CityHelsingør, Denmark
    Period01/01/2008 → …

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