An Experimental Investigation of Diffusion within Electroplated Lead-free Solder Alloy Stacks Combining Elements such as Sn, Cu, Au and/or Zn onto a Ni UBM

René Bergmann, Io Mizushima, Peter Torben Tang, Hans Nørgaard Hansen

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Original languageEnglish
Title of host publicationProceeding of IMAPS NORDIC Conference 2008
PublisherInternational Microelectronics and packaging Society
Publication date2008
Publication statusPublished - 2008
EventIMAPS NORDIC Conference - Helsingør, Denmark
Duration: 1 Jan 2008 → …


ConferenceIMAPS NORDIC Conference
CityHelsingør, Denmark
Period01/01/2008 → …

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