An Experimental Investigation of Diffusion within Electroplated Lead-free Solder Alloy Stacks Combining Elements such as Sn, Cu, Au and/or Zn onto a Ni UBM

René Bergmann, Io Mizushima, Peter Torben Tang, Hans Nørgaard Hansen

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Original languageEnglish
Title of host publicationProceeding of IMAPS NORDIC Conference 2008
PublisherInternational Microelectronics and packaging Society
Publication date2008
Publication statusPublished - 2008
EventIMAPS NORDIC Conference - Helsingør, Denmark
Duration: 1 Jan 2008 → …

Conference

ConferenceIMAPS NORDIC Conference
CityHelsingør, Denmark
Period01/01/2008 → …

Cite this

Bergmann, R., Mizushima, I., Tang, P. T., & Hansen, H. N. (2008). An Experimental Investigation of Diffusion within Electroplated Lead-free Solder Alloy Stacks Combining Elements such as Sn, Cu, Au and/or Zn onto a Ni UBM. In Proceeding of IMAPS NORDIC Conference 2008 International Microelectronics and packaging Society.