Abstract
An electroplating method of forming platings of nickel, cobalt, nickel alloys or cobalt alloys with reduced stresses in an electrodepositing bath of the type: Watt's bath, chloride bath or a combination thereof, by employing pulse plating with periodic reverse pulse and a sulfonated naphthalene additive. This method makes it possible to deposit nickel, cobalt, nickel or cobalt platings without internal stresses.
| Original language | English |
|---|---|
| Patent number | WO1997000980 |
| Filing date | 09/01/1997 |
| Country/Territory | International Bureau of the World Intellectual Property Organization (WIPO) |
| Publication status | Published - 1997 |
Bibliographical note
International application published under the World Intellectual Property Organization (WIPO)Fingerprint
Dive into the research topics of 'AN ELECTROPLATING METHOD OF FORMING PLATINGS OF NICKEL, COBALT, NICKEL ALLOYS OR COBALT ALLOYS'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver