Abstract
An electroplating method of forming platings of nickel, cobalt, nickel alloys or cobalt alloys with reduced stresses in an electrodepositing bath of the type: Watt's bath, chloride bath or a combination thereof, by employing pulse plating with periodic reverse pulse and a sulfonated naphthalene additive. This method makes it possible to deposit nickel, cobalt, nickel or cobalt platings without internal stresses.
Original language | English |
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Patent number | WO1997000980 |
Filing date | 09/01/1997 |
Country/Territory | International Bureau of the World Intellectual Property Organization (WIPO) |
Publication status | Published - 1997 |