AN ELECTROPLATING METHOD OF FORMING PLATINGS OF NICKEL, COBALT, NICKEL ALLOYS OR COBALT ALLOYS

Peter Torben Tang (Inventor), Henrik Dylmer (Inventor), Per Møller (Inventor)

    Research output: Patent

    Abstract

    An electroplating method of forming platings of nickel, cobalt, nickel alloys or cobalt alloys with reduced stresses in an electrodepositing bath of the type: Watt's bath, chloride bath or a combination thereof, by employing pulse plating with periodic reverse pulse and a sulfonated naphthalene additive. This method makes it possible to deposit nickel, cobalt, nickel or cobalt platings without internal stresses.
    Original languageEnglish
    Patent numberWO1997000980
    Filing date09/01/1997
    CountryInternational Bureau of the World Intellectual Property Organization (WIPO)
    Publication statusPublished - 1997

    Bibliographical note

    International application published under the World Intellectual Property Organization (WIPO)

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