An electrophysiological lab on a chip

S. Pedersen, Jonatan Kutchinsky, Søren Friis, K. Kryzywkowski, C.L. Tracy, R. Vestergaard, C.B. Sørensen, H. Vennerberg, Rafael Jozef Taboryski

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review


We present the successful integration of an electroosmotic flow pump and a patch-clamp orifice in the same package. When experiments are performed the electroosmotic pump is used both to position e.g. a single HEK293 cell on a micron-sized orifice and later to rupture the cell membrane, to bring the cell in the whole-cell configuration. In this configuration we are able to perform high quality electrophysiological ion-channel measurements. In the experiments we have used a sieve geometry for the pump. This design is a particularly promising candidate for such an integration scheme. The sieve pumps have relatively low volumetric flow rates, but are able to supply relatively high stall pressures (>200mbar), which make the sieve pumps well suited to work on a load with a high flow resistance e.g. a patch-clamp orifice. In the following we present a characterisation of such electroosmotic sieve pumps. For our system we were able to determine the zeta-potential of the glass/electrolyte interface of to be well above 10mV. Furthermore we also present ion-channel measurements performed on this integrated platform.
Original languageEnglish
VolumeVolume 1 & 2
Publication date2003
ISBN (Print)0-7803-7731-1
Publication statusPublished - 2003
Externally publishedYes
Event12th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) - Boston, United States
Duration: 9 Jun 200312 Jun 2003


Conference12th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)
CountryUnited States

Cite this

Pedersen, S., Kutchinsky, J., Friis, S., Kryzywkowski, K., Tracy, C. L., Vestergaard, R., Sørensen, C. B., Vennerberg, H., & Taboryski, R. J. (2003). An electrophysiological lab on a chip. In BOSTON TRANSDUCERS'03: DIGEST OF TECHNICAL PAPERS (Vol. Volume 1 & 2, pp. 1059-1062). IEEE.