Abstract

Optical interconnects using low-capacitance optoelectronic devices are providing a way forward for the energy-sustainable growth in information technology [1]. For single-die electronic circuits, the co-integration of photonic interconnects faces challenges combining multiple materials, and the typical large size of lasers and detectors.
Original languageEnglish
Publication date30 Jun 2023
Number of pages1
DOIs
Publication statusPublished - 30 Jun 2023
Event2023 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference - Munich, Germany, Munich, Germany
Duration: 26 Jun 202330 Jun 2023

Conference

Conference2023 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference
LocationMunich, Germany
Country/TerritoryGermany
CityMunich
Period26/06/202330/06/2023

Keywords

  • Optical interconnections
  • Lasers
  • Integrated circuit interconnections
  • Detectors
  • Optoelectronic devices
  • Topology
  • System-on-chip

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