Advancing TOPCon Silicon Solar Cells with Laser-Grooved Buried Contact Technology

The integration of the TOPCon structure with Cu-plated metallization and laser-grooved BC technology is a new and untested combination in crystalline silicon solar cell design. This approach will likely leverage the excellent passivation and carrier selectivity of TOPCon to minimize recombination losses and enhance power conversion efficiency (PCE). Cu plating, known for its high conductivity and low cost, reduces resistive losses while supporting sustainability due to the well-known Ag scarcity. Laser ablation enables precise and repeatable groove formation, creating a highly efficient top surface with minimal losses. The narrow metal lines of buried contacts potentially reduce shading losses and finger resistance. This innovation addresses key challenges like shading, parasitic resistance, and cost, while being suitable for advanced applications.