Abnormal grain growth in thin copper foils during high-temperature annealing

J. Guo*, C. L. Zhang, X. Li, T. L. Huang, G. L. Wu, H. F. Shi, D. Juul Jensen, X. X. Huang

*Corresponding author for this work

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Abstract

We investigate grain growth at 1000 °C, a critical temperature for abnormal grain growth in copper foils. By ex-situ annealing experiments at 1000 °C, it is found that abnormal grains grow through the entire sample thickness, forming a polycrystalline structure with a single layer of grains. The migration of the boundaries surrounding the abnormally large grains are characterized by optical microscopy and electron backscatter diffraction. The migration rates are found to vary significantly from place to place, which is analysed based on boundary characteristics, i.e., misorientation and boundary curvature, and the size distribution of the neighbouring grains.
Original languageEnglish
Article number012035
Book seriesJournal of Physics: Conference Series
Volume2635
Issue number1
Number of pages8
ISSN1742-6588
DOIs
Publication statusPublished - 2023
Event8th International Conference on Recrystallization and Grain Growth - Chongqing, China
Duration: 15 May 202319 May 2023

Conference

Conference8th International Conference on Recrystallization and Grain Growth
Country/TerritoryChina
CityChongqing
Period15/05/202319/05/2023

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