A Two-Level Undercut-Profile Substrate for Chemical-Solution-Based Filamentary Coated Conductors

Anders Christian Wulff; Jesper H. Lundeman; Jørn B. Hansen; Oleg Mishin; Zhao Yue; Roya Mohajeri; Jean-Claude Grivel

doi:10.1109/TASC.2016.2536938

A Two-Level Undercut-Profile Substrate for Chemical-Solution-Based Filamentary Coated Conductors

Anders Christian Wulff
, Jesper H. Lundeman
, Jørn B. Hansen
, Oleg Mishin
, Zhao Yue
, Roya Mohajeri
, Jean-Claude Grivel

Department of Energy Conversion and Storage

SUBRA IVS
Sharif University of Technology

Research output: Contribution to journal › Journal article › Research › peer-review

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Abstract

A recently developed two-level undercut-profile substrate (2LUPS), containing two levels of plateaus connected by a curved wall with an undercut profile, enables self-forming filaments in a coated conductor during physical line-of-sight deposition of buffer and superconducting layers. In the present study, the 2LUPS concept is applied to a commercial cube-textured Ni-5at.% W tape, and the surface of the 2LUPS coated with two Gd₂Zr₂O₇ buffer layers using chemical solution deposition is examined. Except for narrow regions near the edge of upper plateaus, the plateaus are found to be covered by strongly textured Gd₂Zr₂O₇ buffer layers after dip coating and sintering.

Original language	English
Article number	6601604
Journal	I E E E Transactions on Applied Superconductivity
Volume	26
Issue number	3
Number of pages	4
ISSN	1051-8223
DOIs	https://doi.org/10.1109/TASC.2016.2536938
Publication status	Published - 2016

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(c) 2016 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.

Keywords

Etching
Scanning electron microscopy
Substrates
Superconducting filaments and wires
Texture

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A Two Level Undercut Profile Substrate for Chemical Solution Based Filamentary Coated Conductors postprintAccepted author manuscript, 1.67 MB

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title = "A Two-Level Undercut-Profile Substrate for Chemical-Solution-Based Filamentary Coated Conductors",

abstract = "A recently developed two-level undercut-profile substrate (2LUPS), containing two levels of plateaus connected by a curved wall with an undercut profile, enables self-forming filaments in a coated conductor during physical line-of-sight deposition of buffer and superconducting layers. In the present study, the 2LUPS concept is applied to a commercial cube-textured Ni-5at.\% W tape, and the surface of the 2LUPS coated with two Gd2Zr2O7 buffer layers using chemical solution deposition is examined. Except for narrow regions near the edge of upper plateaus, the plateaus are found to be covered by strongly textured Gd2Zr2O7 buffer layers after dip coating and sintering.",

keywords = "Etching, Scanning electron microscopy, Substrates, Superconducting filaments and wires, Texture",

author = "Wulff, \{Anders Christian\} and Lundeman, \{Jesper H.\} and Hansen, \{J{\o}rn B.\} and Oleg Mishin and Zhao Yue and Roya Mohajeri and Jean-Claude Grivel",

note = "(c) 2016 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.",

year = "2016",

doi = "10.1109/TASC.2016.2536938",

language = "English",

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journal = "I E E E Transactions on Applied Superconductivity",

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T1 - A Two-Level Undercut-Profile Substrate for Chemical-Solution-Based Filamentary Coated Conductors

AU - Wulff, Anders Christian

AU - Lundeman, Jesper H.

AU - Hansen, Jørn B.

AU - Mishin, Oleg

AU - Yue, Zhao

AU - Mohajeri, Roya

AU - Grivel, Jean-Claude

N1 - (c) 2016 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.

PY - 2016

Y1 - 2016

N2 - A recently developed two-level undercut-profile substrate (2LUPS), containing two levels of plateaus connected by a curved wall with an undercut profile, enables self-forming filaments in a coated conductor during physical line-of-sight deposition of buffer and superconducting layers. In the present study, the 2LUPS concept is applied to a commercial cube-textured Ni-5at.% W tape, and the surface of the 2LUPS coated with two Gd2Zr2O7 buffer layers using chemical solution deposition is examined. Except for narrow regions near the edge of upper plateaus, the plateaus are found to be covered by strongly textured Gd2Zr2O7 buffer layers after dip coating and sintering.

AB - A recently developed two-level undercut-profile substrate (2LUPS), containing two levels of plateaus connected by a curved wall with an undercut profile, enables self-forming filaments in a coated conductor during physical line-of-sight deposition of buffer and superconducting layers. In the present study, the 2LUPS concept is applied to a commercial cube-textured Ni-5at.% W tape, and the surface of the 2LUPS coated with two Gd2Zr2O7 buffer layers using chemical solution deposition is examined. Except for narrow regions near the edge of upper plateaus, the plateaus are found to be covered by strongly textured Gd2Zr2O7 buffer layers after dip coating and sintering.

KW - Etching

KW - Scanning electron microscopy

KW - Substrates

KW - Superconducting filaments and wires

KW - Texture

U2 - 10.1109/TASC.2016.2536938

DO - 10.1109/TASC.2016.2536938

M3 - Journal article

SN - 1051-8223

VL - 26

JO - I E E E Transactions on Applied Superconductivity

JF - I E E E Transactions on Applied Superconductivity

IS - 3

M1 - 6601604

ER -

A Two-Level Undercut-Profile Substrate for Chemical-Solution-Based Filamentary Coated Conductors

Abstract

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