A novel hygrothermal control material and its buffering behaviour in buildings

Pumin Hou, Menghao Qin*, Shuqing Cui, Kan Zu

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingArticle in proceedingsResearchpeer-review

Abstract

High thermal and hygric mass material can suppress temperature and relative humidity variation, which have been widely used for indoor hygrothermal control. Here, A novel of hygrothermal control materials were prepared by simple grinding microencapsulated phase change material (MicroPCM) and metal-organic framework (MOF). Hygrothermal properties of the MOF/MicroPCM composites were measured by differential scanning calorimetry (DSC) and dynamic vapor sorption (DVS) methods. A building model in which the envelope contains MOF/MicroPCM composites was established using WUFI Plus V.3.2. The influence of the MOF/MicroPCM composites on indoor air was studied in a typical summer. Numerical results demonstrate that MOF/MicroPCM composites used as an innovative passive material show great potential for indoor hygrothermal control.
Original languageEnglish
Title of host publication16th International Conference on Indoor Air Quality and Climate (INDOOR AIR 2020) : Proceedings of a meeting held 1 November 2020, Online.
PublisherInternational Society of Indoor Air Quality and Climate
Publication date2020
Pages1450-1455
ISBN (Electronic)978-1-7138-2360-5
Publication statusPublished - 2020
Event 16th Conference of the International Society of Indoor Air Quality & Climate - Online
Duration: 1 Nov 20204 Nov 2020
Conference number: 16

Conference

Conference 16th Conference of the International Society of Indoor Air Quality & Climate
Number16
LocationOnline
Period01/11/202004/11/2020

Keywords

  • Indoor hygrothermal control
  • Hygrothermal buffering
  • Building simulation
  • Energy saving

Fingerprint

Dive into the research topics of 'A novel hygrothermal control material and its buffering behaviour in buildings'. Together they form a unique fingerprint.

Cite this