A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications

Vivek Chidambaram, John Hald, Jesper Henri Hattel

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Abstract

An attempt has been made to determine the lead free ternary combinations that satisfied the solidification requirement for a solder used in level 1 packaging applications, using the CALPHAD approach. The segregation profiles of the promising candidates were analyzed after scrutinizing the equilibrium calculations by Scheil solidification simulations and optimization. A feasibility study has been carried out for the replacement of high-lead-containing solders with the focus on surface tension, natural radius of curvature, oxidation resistance, intermetallic compound formation, and environmental oriented issues.
Original languageEnglish
JournalJournal of Microelectronics and Electronic Packaging
Volume6
Issue number1
Pages (from-to)75-82
ISSN1551-4897
Publication statusPublished - 2009

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