A diamond made microchannel heat sink for high-density heat flux dissipation

Qi Yang, Jingquan Zhao, Yanpei Huang, Xiaowei Zhu, Weichun Fu, Chengming Li, Jianyin Miao*

*Corresponding author for this work

Research output: Contribution to journalJournal articleResearchpeer-review

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Abstract

Flow boiling in microchannels is a promising technique for cooling high power-density electronic devices. In this study, a microchannel heat sink using ammonia as working fluid is developed, and its cooling efficiency is experimentally investigated under nonuniform high-density heat flux, which well simulates a practical heat dissipation scenario for microthermal systems. Diamond with high thermal conductivity of 1500 W/m·K is selected as the microchannel heat sink material. A total of 37 parallel triangular microchannels with aspect ratio of 5, channel length of 45 mm and hydraulic diameter of 280 μm are uniformly engineered on the diamond film by laser ablation processing. The significance of diamond substrate as a heat spreader to minimize the nonuniformity of heat flux imposed by a central hotspot is verified. The influences of heat flux and mass flux on the cooling efficiency are experimentally investigated. An optimal range of outlet vapor quality from 0.10 to 0.13 is found, within which the minimum heat source temperature can be achieved. Notably, the microchannel heat sink is capable of managing a central hotspot with heat flux of 267 W/cm2 while maintaining the heat source temperature at 53.3 °C for a mass flux of 320 kg/m2s.

Original languageEnglish
Article number113804
JournalApplied Thermal Engineering
Volume158
ISSN1359-4311
DOIs
Publication statusPublished - 2019

Keywords

  • Ammonia
  • Cooling efficiency
  • Diamond
  • Flow boiling
  • Hotspot
  • Microchannel

Cite this

Yang, Qi ; Zhao, Jingquan ; Huang, Yanpei ; Zhu, Xiaowei ; Fu, Weichun ; Li, Chengming ; Miao, Jianyin. / A diamond made microchannel heat sink for high-density heat flux dissipation. In: Applied Thermal Engineering. 2019 ; Vol. 158.
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title = "A diamond made microchannel heat sink for high-density heat flux dissipation",
abstract = "Flow boiling in microchannels is a promising technique for cooling high power-density electronic devices. In this study, a microchannel heat sink using ammonia as working fluid is developed, and its cooling efficiency is experimentally investigated under nonuniform high-density heat flux, which well simulates a practical heat dissipation scenario for microthermal systems. Diamond with high thermal conductivity of 1500 W/m·K is selected as the microchannel heat sink material. A total of 37 parallel triangular microchannels with aspect ratio of 5, channel length of 45 mm and hydraulic diameter of 280 μm are uniformly engineered on the diamond film by laser ablation processing. The significance of diamond substrate as a heat spreader to minimize the nonuniformity of heat flux imposed by a central hotspot is verified. The influences of heat flux and mass flux on the cooling efficiency are experimentally investigated. An optimal range of outlet vapor quality from 0.10 to 0.13 is found, within which the minimum heat source temperature can be achieved. Notably, the microchannel heat sink is capable of managing a central hotspot with heat flux of 267 W/cm2 while maintaining the heat source temperature at 53.3 °C for a mass flux of 320 kg/m2s.",
keywords = "Ammonia, Cooling efficiency, Diamond, Flow boiling, Hotspot, Microchannel",
author = "Qi Yang and Jingquan Zhao and Yanpei Huang and Xiaowei Zhu and Weichun Fu and Chengming Li and Jianyin Miao",
year = "2019",
doi = "10.1016/j.applthermaleng.2019.113804",
language = "English",
volume = "158",
journal = "Applied Thermal Engineering",
issn = "1359-4311",
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A diamond made microchannel heat sink for high-density heat flux dissipation. / Yang, Qi; Zhao, Jingquan; Huang, Yanpei; Zhu, Xiaowei; Fu, Weichun; Li, Chengming; Miao, Jianyin.

In: Applied Thermal Engineering, Vol. 158, 113804, 2019.

Research output: Contribution to journalJournal articleResearchpeer-review

TY - JOUR

T1 - A diamond made microchannel heat sink for high-density heat flux dissipation

AU - Yang, Qi

AU - Zhao, Jingquan

AU - Huang, Yanpei

AU - Zhu, Xiaowei

AU - Fu, Weichun

AU - Li, Chengming

AU - Miao, Jianyin

PY - 2019

Y1 - 2019

N2 - Flow boiling in microchannels is a promising technique for cooling high power-density electronic devices. In this study, a microchannel heat sink using ammonia as working fluid is developed, and its cooling efficiency is experimentally investigated under nonuniform high-density heat flux, which well simulates a practical heat dissipation scenario for microthermal systems. Diamond with high thermal conductivity of 1500 W/m·K is selected as the microchannel heat sink material. A total of 37 parallel triangular microchannels with aspect ratio of 5, channel length of 45 mm and hydraulic diameter of 280 μm are uniformly engineered on the diamond film by laser ablation processing. The significance of diamond substrate as a heat spreader to minimize the nonuniformity of heat flux imposed by a central hotspot is verified. The influences of heat flux and mass flux on the cooling efficiency are experimentally investigated. An optimal range of outlet vapor quality from 0.10 to 0.13 is found, within which the minimum heat source temperature can be achieved. Notably, the microchannel heat sink is capable of managing a central hotspot with heat flux of 267 W/cm2 while maintaining the heat source temperature at 53.3 °C for a mass flux of 320 kg/m2s.

AB - Flow boiling in microchannels is a promising technique for cooling high power-density electronic devices. In this study, a microchannel heat sink using ammonia as working fluid is developed, and its cooling efficiency is experimentally investigated under nonuniform high-density heat flux, which well simulates a practical heat dissipation scenario for microthermal systems. Diamond with high thermal conductivity of 1500 W/m·K is selected as the microchannel heat sink material. A total of 37 parallel triangular microchannels with aspect ratio of 5, channel length of 45 mm and hydraulic diameter of 280 μm are uniformly engineered on the diamond film by laser ablation processing. The significance of diamond substrate as a heat spreader to minimize the nonuniformity of heat flux imposed by a central hotspot is verified. The influences of heat flux and mass flux on the cooling efficiency are experimentally investigated. An optimal range of outlet vapor quality from 0.10 to 0.13 is found, within which the minimum heat source temperature can be achieved. Notably, the microchannel heat sink is capable of managing a central hotspot with heat flux of 267 W/cm2 while maintaining the heat source temperature at 53.3 °C for a mass flux of 320 kg/m2s.

KW - Ammonia

KW - Cooling efficiency

KW - Diamond

KW - Flow boiling

KW - Hotspot

KW - Microchannel

U2 - 10.1016/j.applthermaleng.2019.113804

DO - 10.1016/j.applthermaleng.2019.113804

M3 - Journal article

VL - 158

JO - Applied Thermal Engineering

JF - Applied Thermal Engineering

SN - 1359-4311

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