A D-Band Rectangular Waveguide-to-Coplanar Waveguide Transition Using Wire Bonding Probe

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This paper presents a rectangular waveguide-to-coplanar waveguide (CPW) transition at D-band (110–170 GHz) using wire bonding probe. A conventional CPW is
designed and fabricated based on both quartz and glass substrates for estimating the losses at D-band and testing the fabrication processes. Two transition prototypes at D-band using E-plane probe and wire bonding probe are designed, fabricated, and measured in a back-to-back configuration. The system packaging approaches and scattering parameters of the transition prototypes are compared. For both on-chip and carrier substrate approaches, chips can be tested individually before packaged into a system and extra connections are not required. The fabricated rectangular waveguide-to-CPW transition at D-band using wire bonding probe in a back-to-back configuration exhibits a bandwidth of 56.3 GHz ranging from 110 to 166.3 GHz in which the return loss is better than 10 dB with an associated insertion loss of 2 dB. Compared with the fabricated rectangular waveguide-to-CPW transition using E-plane probe, an equivalent bandwidth is achieved at D-band while the system packaging approaches are more versatile and compact for the proposed transition using wire bonding probe
Original languageEnglish
JournalJournal of Infrared, Millimeter and Terahertz Waves
Number of pages17
Publication statusPublished - 2018
CitationsWeb of Science® Times Cited: No match on DOI

    Research areas

  • Coplanar waveguide (CPW), E-plane probe, Packaging, Rectangular waveguide, Wideband transition, Wire bonding probe
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ID: 160466275